Abstract
A new optical interconnect technique, suitable for high packing densities, is demonstrated for implementation in very-large-scale integration circuits. The approach permits vertical bonding.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 109-111 |
| Number of pages | 3 |
| Journal | Optics Letters |
| Volume | 11 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 1986 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics