Abstract
A new optical interconnect technique, suitable for high packing densities, is demonstrated for implementation in very-large-scale integration circuits. The approach permits vertical bonding.
Original language | English (US) |
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Pages (from-to) | 109-111 |
Number of pages | 3 |
Journal | Optics Letters |
Volume | 11 |
Issue number | 2 |
DOIs | |
State | Published - Feb 1986 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics