Hybrid large-area systems: Challenges in interfacing

Tiffany Moy, Sigurd Wagner, Warren Rieutort-Louis, Yingzhe Hu, Liechao Huang, Josue Sanz-Robinson, James C. Sturm, Naveen Verma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.

Original languageEnglish (US)
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1374-1377
Number of pages4
ISBN (Electronic)9781479953400
DOIs
StatePublished - Jul 29 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada
Duration: May 22 2016May 25 2016

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2016-July
ISSN (Print)0271-4310

Other

Other2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
CountryCanada
CityMontreal
Period5/22/165/25/16

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Keywords

  • hybrid systems
  • large-area electronics (LAE)
  • thin-film sensors
  • thin-film transistors (TFTs)

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  • Cite this

    Moy, T., Wagner, S., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C., & Verma, N. (2016). Hybrid large-area systems: Challenges in interfacing. In ISCAS 2016 - IEEE International Symposium on Circuits and Systems (pp. 1374-1377). [7527505] (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2016-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2016.7527505