Hybrid large-area systems: Challenges in interfacing

Tiffany Moy, Sigurd Wagner, Warren Rieutort-Louis, Yingzhe Hu, Liechao Huang, Josue Sanz-Robinson, James C. Sturm, Naveen Verma

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.

Original languageEnglish (US)
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages4
ISBN (Electronic)9781479953400
StatePublished - Jul 29 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada
Duration: May 22 2016May 25 2016

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310


Other2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering


  • hybrid systems
  • large-area electronics (LAE)
  • thin-film sensors
  • thin-film transistors (TFTs)


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