Hybrid large-area systems: Challenges in interfacing

Tiffany Moy; Sigurd Wagner; Warren Rieutort-Louis; Yingzhe Hu; Liechao Huang; Josue Sanz-Robinson; James C. Sturm; Naveen Verma

doi:10.1109/ISCAS.2016.7527505

Hybrid large-area systems: Challenges in interfacing

Tiffany Moy, Sigurd Wagner, Warren Rieutort-Louis, Yingzhe Hu, Liechao Huang, Josue Sanz-Robinson, James C. Sturm, Naveen Verma

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.

Original language	English (US)
Title of host publication	ISCAS 2016 - IEEE International Symposium on Circuits and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1374-1377
Number of pages	4
ISBN (Electronic)	9781479953400
DOIs	https://doi.org/10.1109/ISCAS.2016.7527505
State	Published - Jul 29 2016
Event	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada Duration: May 22 2016 → May 25 2016

Publication series

Name	Proceedings - IEEE International Symposium on Circuits and Systems
Volume	2016-July
ISSN (Print)	0271-4310

Other

Other	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Country/Territory	Canada
City	Montreal
Period	5/22/16 → 5/25/16

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Keywords

hybrid systems
large-area electronics (LAE)
thin-film sensors
thin-film transistors (TFTs)

Access to Document

10.1109/ISCAS.2016.7527505

Cite this

Moy, T., Wagner, S., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C., & Verma, N. (2016). Hybrid large-area systems: Challenges in interfacing. In ISCAS 2016 - IEEE International Symposium on Circuits and Systems (pp. 1374-1377). Article 7527505 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2016-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2016.7527505

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abstract = "Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.",

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author = "Tiffany Moy and Sigurd Wagner and Warren Rieutort-Louis and Yingzhe Hu and Liechao Huang and Josue Sanz-Robinson and Sturm, {James C.} and Naveen Verma",

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doi = "10.1109/ISCAS.2016.7527505",

language = "English (US)",

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Moy, T, Wagner, S, Rieutort-Louis, W, Hu, Y, Huang, L, Sanz-Robinson, J, Sturm, JC & Verma, N 2016, Hybrid large-area systems: Challenges in interfacing. in ISCAS 2016 - IEEE International Symposium on Circuits and Systems., 7527505, Proceedings - IEEE International Symposium on Circuits and Systems, vol. 2016-July, Institute of Electrical and Electronics Engineers Inc., pp. 1374-1377, 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montreal, Canada, 5/22/16. https://doi.org/10.1109/ISCAS.2016.7527505

Hybrid large-area systems: Challenges in interfacing. / Moy, Tiffany; Wagner, Sigurd; Rieutort-Louis, Warren et al.
ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1374-1377 7527505 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Moy T, Wagner S, Rieutort-Louis W, Hu Y, Huang L, Sanz-Robinson J et al. Hybrid large-area systems: Challenges in interfacing. In ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1374-1377. 7527505. (Proceedings - IEEE International Symposium on Circuits and Systems). doi: 10.1109/ISCAS.2016.7527505

Hybrid large-area systems: Challenges in interfacing

Abstract

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All Science Journal Classification (ASJC) codes

Keywords

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