@inproceedings{cad8669eb7f146149bf36faeb077e638,
title = "Hybrid large-area systems and their interconnection backbone (invited paper)",
abstract = "Hybrid systems combine Large-Area Electronics (LAE) with high-performance technologies (e.g., silicon CMOS) [1]. With architectural concepts for hybrid systems broadening to match the range of emerging applications, this paper examines modular approaches for multi-sheet, multi-technology integration. It identifies the interfaces required as a critical backbone. For interfaces associated with various system functionalities (sensing, processing, powering), specific approaches are surveyed and analyzed, taking from insights derived from several previous experimental demonstrations of complete hybrid systems.",
keywords = "Large-area electronics, hybrid systems, thin-film transistors",
author = "Naveen Verma and L. Aygun and Y. Afsar and Y. Hu and L. Huang and T. Moy and J. Sanz-Robinson and W. Rieutort-Louis and S. Wagner and Sturm, {J. C.}",
year = "2016",
month = sep,
day = "28",
doi = "10.1109/NOCS.2016.7579342",
language = "English (US)",
series = "2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016",
address = "United States",
note = "10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016 ; Conference date: 31-08-2016 Through 02-09-2016",
}