High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs

Yingzhe Hu, Warren Rieutort-Louis, Josue Sanz-Robinson, Katherine Song, James Christopher Sturm, Sigurd Wagner, Naveen Verma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

Early-stage damage detection for buildings and bridges requires continuously sensing and assessing strain over large surfaces, yet with centimeter-scale resolution. To achieve this, we present a sensing sheet that combines high-performance ICs with exible electronics, allowing bonding to such surfaces. The exible electronics integrates thin-film strain gauges and amorphous-silicon control circuits, patterned on a polyimide sheet that can potentially span large areas. Non-contact links couple digital and analog signals to the ICs, allowing many ICs to be introduced via low-cost sheet lamination for energy-efficient readout and computation over a large number of sensors. Communication between distributed ICs is achieved by transceivers that exploit low-loss interconnects patterned on the polyimide sheet; the transceivers self-calibrate to the interconnect impedance to maximize transmit SNR. The system achieves multi-channel strain readout with sensitivity of 18μStrainRMS at an energy per measurement of 270nJ, while the communication energy is 12.8pJ/3.3pJ per bit (Tx/Rx) over 7.5m.

Original languageEnglish (US)
Title of host publication2012 Symposium on VLSI Circuits, VLSIC 2012
Pages120-121
Number of pages2
DOIs
StatePublished - Sep 28 2012
Event2012 Symposium on VLSI Circuits, VLSIC 2012 - Honolulu, HI, United States
Duration: Jun 13 2012Jun 15 2012

Publication series

NameIEEE Symposium on VLSI Circuits, Digest of Technical Papers

Other

Other2012 Symposium on VLSI Circuits, VLSIC 2012
CountryUnited States
CityHonolulu, HI
Period6/13/126/15/12

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Hu, Y., Rieutort-Louis, W., Sanz-Robinson, J., Song, K., Sturm, J. C., Wagner, S., & Verma, N. (2012). High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs. In 2012 Symposium on VLSI Circuits, VLSIC 2012 (pp. 120-121). [6243819] (IEEE Symposium on VLSI Circuits, Digest of Technical Papers). https://doi.org/10.1109/VLSIC.2012.6243819