High resolution copper lines by direct imprinting

C. M. Hong; X. Sun; S. Wagner; S. Y. Chou

doi:10.1557/proc-624-219

High resolution copper lines by direct imprinting

C. M. Hong, X. Sun, S. Wagner, S. Y. Chou

Research output: Contribution to journal › Conference article › peer-review

3 Scopus citations

Abstract

One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.

Original language	English (US)
Pages (from-to)	219-223
Number of pages	5
Journal	Materials Research Society Symposium - Proceedings
Volume	624
DOIs	https://doi.org/10.1557/proc-624-219
State	Published - 2000
Event	Materials Development for Direct Write Technologies - San Francisco, CA, United States Duration: Apr 24 2000 → Apr 26 2000

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/proc-624-219

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@article{6a1778cfc8864e6a90ef97e811d854e8,

title = "High resolution copper lines by direct imprinting",

abstract = "One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.",

author = "Hong, {C. M.} and X. Sun and S. Wagner and Chou, {S. Y.}",

year = "2000",

doi = "10.1557/proc-624-219",

language = "English (US)",

volume = "624",

pages = "219--223",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

}

TY - JOUR

T1 - High resolution copper lines by direct imprinting

AU - Hong, C. M.

AU - Sun, X.

AU - Wagner, S.

AU - Chou, S. Y.

PY - 2000

Y1 - 2000

N2 - One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.

AB - One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.

UR - http://www.scopus.com/inward/record.url?scp=0034445228&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034445228&partnerID=8YFLogxK

U2 - 10.1557/proc-624-219

DO - 10.1557/proc-624-219

M3 - Conference article

AN - SCOPUS:0034445228

VL - 624

SP - 219

EP - 223

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

SN - 0272-9172

T2 - Materials Development for Direct Write Technologies

Y2 - 24 April 2000 through 26 April 2000

ER -

High resolution copper lines by direct imprinting

Abstract

All Science Journal Classification (ASJC) codes

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