High resolution copper lines by direct imprinting

C. M. Hong, X. Sun, S. Wagner, S. Y. Chou

Research output: Contribution to journalConference article

3 Scopus citations

Abstract

One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.

Original languageEnglish (US)
Pages (from-to)219-223
Number of pages5
JournalMaterials Research Society Symposium - Proceedings
Volume624
DOIs
StatePublished - 2000
EventMaterials Development for Direct Write Technologies - San Francisco, CA, United States
Duration: Apr 24 2000Apr 26 2000

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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