Abstract
One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 219-223 |
| Number of pages | 5 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 624 |
| DOIs | |
| State | Published - 2000 |
| Event | Materials Development for Direct Write Technologies - San Francisco, CA, United States Duration: Apr 24 2000 → Apr 26 2000 |
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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Hong, C. M., Sun, X., Wagner, S., & Chou, S. Y. (2000). High resolution copper lines by direct imprinting. Materials Research Society Symposium - Proceedings, 624, 219-223. https://doi.org/10.1557/proc-624-219