TY - JOUR
T1 - High resolution copper lines by direct imprinting
AU - Hong, C. M.
AU - Sun, X.
AU - Wagner, S.
AU - Chou, S. Y.
N1 - Funding Information:
". Presented at the 5th German-Japanese Cooperative Symposium on Protozoan Diseases, Tokyo, Japan, Sept. 25-28, 1985. This study was supported in part by Grant No. 58480079*1 and 59440017*2 from the Scientific Research Found of the Japanese Ministry of Education, Science and Culture. ,,3 Foreign visiting professor supported by the Ministry of Education, Science and Culture, Japan. On leave from the Institute of Medical Parasitology, University of Bonn, Bonn, FRG.
PY - 2000
Y1 - 2000
N2 - One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.
AB - One-micrometer wide copper lines are patterned by direct imprinting and thermolysis. First, a layer of plastic copper hexanoate is spun on a substrate and patterned by direct imprint. Then the copper hexanoate line pattern is converted to copper metal lines by thermal and hydrogen anneals. The converted copper film resistivity is ∼ 8 μΩcm. The direct imprinting of a fine metal pattern points the way to the direct patterning of device materials at high resolution.
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U2 - 10.1557/proc-624-219
DO - 10.1557/proc-624-219
M3 - Conference article
AN - SCOPUS:0034445228
SN - 0272-9172
VL - 624
SP - 219
EP - 223
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Materials Development for Direct Write Technologies
Y2 - 24 April 2000 through 26 April 2000
ER -