Abstract
Increasing digital system complexity and integration density motivate automation of the integrated circuit design process. High-level synthesis is a promising method of increasing designer productivity. Continued process scaling and increasing integration density result in increased power consumption, power density, and temperature. High-level synthesis for integrated circuit (IC) power and thermal optimization has been an active research area in the recent past. This chapter explains the challenges power and temperature optimization pose for high-level synthesis researchers and summarizes research progress to date.
Original language | English (US) |
---|---|
Title of host publication | High-Level Synthesis |
Subtitle of host publication | From Algorithm to Digital Circuit |
Publisher | Springer Netherlands |
Pages | 285-297 |
Number of pages | 13 |
ISBN (Print) | 9781402085871 |
DOIs | |
State | Published - 2008 |
All Science Journal Classification (ASJC) codes
- General Engineering
Keywords
- Behavioral synthesis
- High-level synthesis
- Power
- Reliability
- Temperature
- Thermal modeling