Fully-depleted Strained-Si on Insulator NMOSFETs without Relaxed SiGe Buffers

Haizhou Yin, K. D. Hobart, Rebecca L. Peterson, F. J. Kub, S. R. Shieh, T. S. Duffy, J. C. Sturm

Research output: Contribution to journalConference articlepeer-review

17 Scopus citations


Fully-depleted strained Si n-channel MOSFETs were demonstrated on a compliant borophosphorosilicate insulator (BPSG) without an underlying SiGe buffer layer. Stress balance of a SiGe/Si structure, transferred onto BPSG by wafer bonding and Smart-cut® processes, is utilized for the first time to make strained-Si on insulator (sSOI) by a process that does not involve the introduction of misfit dislocations. Strained-Si n-channel MOSFETs with a strain level of 0.6%, equivalent to that of a conventional strained Si layer grown on a relaxed Si 0.85Ge 0.15 buffer, exhibit 60% mobility enhancement over the control, in good agreement with theory. This approach to fabricating strained Si overcomes any potential process or device complexity due to the presence of a SiGe layer in the final devices.

Original languageEnglish (US)
Pages (from-to)53-56
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
StatePublished - 2003
EventIEEE International Electron Devices Meeting - Washington, DC, United States
Duration: Dec 8 2003Dec 10 2003

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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