Fracture of thin film structures with creeping underlayer

R. Huang; J. Liang; J. H. Prévost; Z. Suo

doi:10.1115/IMECE2003-42989

Fracture of thin film structures with creeping underlayer

R. Huang, J. Liang, J. H. Prévost, Z. Suo

Civil & Environmental Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

The fracture in small dimensions, of thin film structures lying on a creeping underlayer was studied. It was discovered that under cyclic temperatures, cracks could grow in brittle films driven by ratcheting plastic deformation in a metal underlayer. Initially, the film was in a uniform biaxial tensile stress which drove pre-existing flaws to grow into channel cracks in the film. It was found that when the crack tip moved rapidly, the crack wake had a short time to relax, and the stress intensity around the crack tip decreased.

Original language	English (US)
Pages (from-to)	143-144
Number of pages	2
Journal	American Society of Mechanical Engineers, Materials Division (Publication) MD
Volume	98
DOIs	https://doi.org/10.1115/IMECE2003-42989
State	Published - 2003
Event	2003 ASME International Mechanical Engineering Congress - Washington, DC., United States Duration: Nov 15 2003 → Nov 21 2003

All Science Journal Classification (ASJC) codes

General Engineering

Access to Document

10.1115/IMECE2003-42989

Cite this

@article{e33c814a9c774e1db5041336b8dd17a3,

title = "Fracture of thin film structures with creeping underlayer",

abstract = "The fracture in small dimensions, of thin film structures lying on a creeping underlayer was studied. It was discovered that under cyclic temperatures, cracks could grow in brittle films driven by ratcheting plastic deformation in a metal underlayer. Initially, the film was in a uniform biaxial tensile stress which drove pre-existing flaws to grow into channel cracks in the film. It was found that when the crack tip moved rapidly, the crack wake had a short time to relax, and the stress intensity around the crack tip decreased.",

author = "R. Huang and J. Liang and Pr{\'e}vost, {J. H.} and Z. Suo",

year = "2003",

doi = "10.1115/IMECE2003-42989",

language = "English (US)",

volume = "98",

pages = "143--144",

journal = "American Society of Mechanical Engineers, Materials Division (Publication) MD",

issn = "1071-6939",

note = "2003 ASME International Mechanical Engineering Congress ; Conference date: 15-11-2003 Through 21-11-2003",

}

TY - JOUR

T1 - Fracture of thin film structures with creeping underlayer

AU - Huang, R.

AU - Liang, J.

AU - Prévost, J. H.

AU - Suo, Z.

PY - 2003

Y1 - 2003

N2 - The fracture in small dimensions, of thin film structures lying on a creeping underlayer was studied. It was discovered that under cyclic temperatures, cracks could grow in brittle films driven by ratcheting plastic deformation in a metal underlayer. Initially, the film was in a uniform biaxial tensile stress which drove pre-existing flaws to grow into channel cracks in the film. It was found that when the crack tip moved rapidly, the crack wake had a short time to relax, and the stress intensity around the crack tip decreased.

AB - The fracture in small dimensions, of thin film structures lying on a creeping underlayer was studied. It was discovered that under cyclic temperatures, cracks could grow in brittle films driven by ratcheting plastic deformation in a metal underlayer. Initially, the film was in a uniform biaxial tensile stress which drove pre-existing flaws to grow into channel cracks in the film. It was found that when the crack tip moved rapidly, the crack wake had a short time to relax, and the stress intensity around the crack tip decreased.

UR - http://www.scopus.com/inward/record.url?scp=1842526044&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1842526044&partnerID=8YFLogxK

U2 - 10.1115/IMECE2003-42989

DO - 10.1115/IMECE2003-42989

M3 - Conference article

AN - SCOPUS:1842526044

SN - 1071-6939

VL - 98

SP - 143

EP - 144

JO - American Society of Mechanical Engineers, Materials Division (Publication) MD

JF - American Society of Mechanical Engineers, Materials Division (Publication) MD

T2 - 2003 ASME International Mechanical Engineering Congress

Y2 - 15 November 2003 through 21 November 2003

ER -

Fracture of thin film structures with creeping underlayer

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this