Fracture of thin film structures with creeping underlayer

R. Huang, J. Liang, Jean-Herve Prevost, Z. Suo

Research output: Contribution to journalConference article

Abstract

The fracture in small dimensions, of thin film structures lying on a creeping underlayer was studied. It was discovered that under cyclic temperatures, cracks could grow in brittle films driven by ratcheting plastic deformation in a metal underlayer. Initially, the film was in a uniform biaxial tensile stress which drove pre-existing flaws to grow into channel cracks in the film. It was found that when the crack tip moved rapidly, the crack wake had a short time to relax, and the stress intensity around the crack tip decreased.

Original languageEnglish (US)
Pages (from-to)143-144
Number of pages2
JournalAmerican Society of Mechanical Engineers, Materials Division (Publication) MD
Volume98
DOIs
StatePublished - Jan 1 2003
Event2003 ASME International Mechanical Engineering Congress - Washington, DC., United States
Duration: Nov 15 2003Nov 21 2003

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Fracture of thin film structures with creeping underlayer'. Together they form a unique fingerprint.

  • Cite this