Fracture mechanisms of sink thin-films on compliant substrates

Engineering & Materials Science

• Thin films 86%
• Substrates 64%
• Polymers 58%
• Metal foil 24%
• Compressive stress 23%
• Thermal expansion 23%
• Focused ion beams 15%
• Thin film transistors 14%
• Silicon nitride 13%
• Chemical vapor deposition 13%
• Tensile stress 11%
• Residual stresses 10%
• Electronic equipment 9%
• Scanning electron microscopy 9%
• Cracks 7%

Physics & Astronomy

• sinks 100%
• thin films 47%
• polymers 46%
• causes 21%
• foils 20%
• thermal expansion 19%
• coefficients 12%
• tensile stress 11%
• silicon nitrides 11%
• transistors 9%
• ion beams 8%
• cracks 8%
• vapor deposition 8%
• scanning electron microscopy 7%
• electronics 5%

Chemical Compounds

• Thermal Expansion 32%
• Foil 30%
• Liquid Film 14%
• Nitride 14%
• Tension 14%
• Strain 10%
• Scanning Electron Microscopy 9%