Flexible metal film with micro- and nanopatterns transferred by electrochemical deposition

Jun Feng, Bo Cui, Yong Zhan, Stephen Y. Chou

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

A new method for patterning microstructure on metal film by electrochemical deposition is provided. The metal film with micropattern can be peeled off after the deposition by inter-medium layer of resistant molecules such as triglyceride. We can use the technology of electrochemical deposition to make the metal film possess different functions such as soft and bendable properties. We also give an example to get the protein pattern transferred on the metal film. So, this method can also provide a way for the fabrication of protein pattern on the chip.

Original languageEnglish (US)
Pages (from-to)102-104
Number of pages3
JournalElectrochemistry Communications
Volume4
Issue number2
DOIs
StatePublished - Mar 6 2002

All Science Journal Classification (ASJC) codes

  • Electrochemistry

Keywords

  • Metal film
  • Micro- and nanopatterns
  • Peel off
  • Protein pattern

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