Flexible, lightweight steel-foil substrates for a-Si:H thin-film transistors

S. D. Theiss; C. C. Wu; M. Lu; J. C. Sturm; S. Wagner

doi:10.1557/proc-471-21

Flexible, lightweight steel-foil substrates for a-Si:H thin-film transistors

S. D. Theiss, C. C. Wu, M. Lu, J. C. Sturm, S. Wagner

Research output: Contribution to journal › Conference article › peer-review

8 Scopus citations

Abstract

For many flat panel display applications, traditional glass substrates for the TFT backplane are not sufficiently rugged. Therefore, we have begun to explore the use of steel foils as TFT substrates for emissive or reflective displays. We report the fabrication of high quality a-Si:H TFTs on lightweight, flexible 75 μm thick stainless steel foils. The electrical characteristics of the TFTs were good and were not significantly affected by either dropping over 15 meters to a concrete floor or being bent to a radius of curvature of 8.25 cm for a period of over 400 hours. Typical device characteristics were: I_ON/I_OFF>10⁷, I_OFF to approximately 10^-12 A, V_T to approximately 3.2 V, and μ_EFF to approximately 0.9 cm²/Vs. We also discuss our recent work on the successful integration of organic light-emitting diodes (OLEDs) with TFTs on steel substrates, resulting in a new form of emissive display.

Original language	English (US)
Pages (from-to)	21-26
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	471
DOIs	https://doi.org/10.1557/proc-471-21
State	Published - 1997
Event	Proceedings of the 1997 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 1 1997 → Apr 4 1997

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1557/proc-471-21

Cite this

@article{f75ae32d92274123835ee6002166964a,

title = "Flexible, lightweight steel-foil substrates for a-Si:H thin-film transistors",

abstract = "For many flat panel display applications, traditional glass substrates for the TFT backplane are not sufficiently rugged. Therefore, we have begun to explore the use of steel foils as TFT substrates for emissive or reflective displays. We report the fabrication of high quality a-Si:H TFTs on lightweight, flexible 75 μm thick stainless steel foils. The electrical characteristics of the TFTs were good and were not significantly affected by either dropping over 15 meters to a concrete floor or being bent to a radius of curvature of 8.25 cm for a period of over 400 hours. Typical device characteristics were: ION/IOFF>107, IOFF to approximately 10-12 A, VT to approximately 3.2 V, and μEFF to approximately 0.9 cm2/Vs. We also discuss our recent work on the successful integration of organic light-emitting diodes (OLEDs) with TFTs on steel substrates, resulting in a new form of emissive display.",

author = "Theiss, {S. D.} and Wu, {C. C.} and M. Lu and Sturm, {J. C.} and S. Wagner",

year = "1997",

doi = "10.1557/proc-471-21",

language = "English (US)",

volume = "471",

pages = "21--26",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Proceedings of the 1997 MRS Spring Meeting ; Conference date: 01-04-1997 Through 04-04-1997",

}

TY - JOUR

T1 - Flexible, lightweight steel-foil substrates for a-Si:H thin-film transistors

AU - Theiss, S. D.

AU - Wu, C. C.

AU - Lu, M.

AU - Sturm, J. C.

AU - Wagner, S.

PY - 1997

Y1 - 1997

N2 - For many flat panel display applications, traditional glass substrates for the TFT backplane are not sufficiently rugged. Therefore, we have begun to explore the use of steel foils as TFT substrates for emissive or reflective displays. We report the fabrication of high quality a-Si:H TFTs on lightweight, flexible 75 μm thick stainless steel foils. The electrical characteristics of the TFTs were good and were not significantly affected by either dropping over 15 meters to a concrete floor or being bent to a radius of curvature of 8.25 cm for a period of over 400 hours. Typical device characteristics were: ION/IOFF>107, IOFF to approximately 10-12 A, VT to approximately 3.2 V, and μEFF to approximately 0.9 cm2/Vs. We also discuss our recent work on the successful integration of organic light-emitting diodes (OLEDs) with TFTs on steel substrates, resulting in a new form of emissive display.

AB - For many flat panel display applications, traditional glass substrates for the TFT backplane are not sufficiently rugged. Therefore, we have begun to explore the use of steel foils as TFT substrates for emissive or reflective displays. We report the fabrication of high quality a-Si:H TFTs on lightweight, flexible 75 μm thick stainless steel foils. The electrical characteristics of the TFTs were good and were not significantly affected by either dropping over 15 meters to a concrete floor or being bent to a radius of curvature of 8.25 cm for a period of over 400 hours. Typical device characteristics were: ION/IOFF>107, IOFF to approximately 10-12 A, VT to approximately 3.2 V, and μEFF to approximately 0.9 cm2/Vs. We also discuss our recent work on the successful integration of organic light-emitting diodes (OLEDs) with TFTs on steel substrates, resulting in a new form of emissive display.

UR - http://www.scopus.com/inward/record.url?scp=0030673604&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030673604&partnerID=8YFLogxK

U2 - 10.1557/proc-471-21

DO - 10.1557/proc-471-21

M3 - Conference article

AN - SCOPUS:0030673604

SN - 0272-9172

VL - 471

SP - 21

EP - 26

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1997 MRS Spring Meeting

Y2 - 1 April 1997 through 4 April 1997

ER -

Flexible, lightweight steel-foil substrates for a-Si:H thin-film transistors

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this