Abstract
A new optical interconnect technique, suitable for very high packing densities, is proposed for implementation in VHSIC/VLSI circuits. The approach allows vertical bonding.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 154-158 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 625 |
| DOIs | |
| State | Published - Jun 9 1986 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
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