Abstract
A new optical interconnect technique, suitable for very high packing densities, is proposed for implementation in VHSIC/VLSI circuits. The approach allows vertical bonding.
Original language | English (US) |
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Pages (from-to) | 154-158 |
Number of pages | 5 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 625 |
DOIs | |
State | Published - Jun 9 1986 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering