Abstract
We present the fabrication and performance of a metal-semiconductor-metal (MSM) photodetector with high efficiency and high speed. The MSM photodetector is fabricated on a 501 substrate with a 170-nm-thick Si active layer. A scattering backside reflector, consisting of inverted pyramids with 193-nm-long sides and 54.7° slopes, is buried underneath the active layer. This scattering buried backside reflector (SBBR) causes the trapping of light inside the active layer, resulting in an MSM photodetector with a response time of 5.4 ps and responsivity comparable with those on bulk Si at both the visible and infrared.
Original language | English (US) |
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Pages (from-to) | 329-336 |
Number of pages | 8 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 3048 |
DOIs | |
State | Published - Jul 7 1997 |
Externally published | Yes |
Event | Emerging Lithographic Technologies 1997 - Santa Clara, United States Duration: Mar 10 1997 → Mar 14 1997 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Keywords
- Backside reflectors
- MSM photodetectors
- Si-on-insulator