Evaluating the coefficient of thermal expansion using time periods of minimal thermal gradient for a temperature driven structural health monitoring

J. Reilly, H. Abdel-Jaber, M. Yarnold, B. Glisic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

Structural Health Monitoring aims to characterize the performance of a structure from a combination of recorded sensor data and analytic techniques. Many methods are concerned with quantifying the elastic response of the structure, treating temperature changes as noise in the analysis. While these elastic profiles do demonstrate a portion of structural behavior, thermal loads on a structure can induce comparable strains to elastic loads. Understanding this relationship between the temperature of the structure and the resultant strain and displacement can provide in depth knowledge of the structural condition. A necessary parameter for this form of analysis is the Coefficient of Thermal Expansion (CTE). The CTE of a material relates the amount of expansion or contraction a material undergoes per degree change in temperature, and can be determined from temperature-strain relationship given that the thermal strain can be isolated. Many times with concrete, the actual amount of expansion with temperature in situ varies from the given values for the CTE due to thermally generated elastic strain, which complicates evaluation of the CTE. To accurately characterize the relationship between temperature and strain on a structure, the actual thermal behavior of the structure needs to be analyzed. This rate can vary for different parts of a structure, depending on boundary conditions. In a case of unrestrained structures, the strain in the structure should be linearly related to the temperature change. Thermal gradients in a structure can affect this relationship, as they induce curvature and deplanations in the cross section. This paper proposes a method that addresses these challenges in evaluating the CTE.

Original languageEnglish (US)
Title of host publicationNondestructive Characterization and Monitoring of Advanced Materials, Aerospace, and Civil Infrastructure 2017
EditorsTzu-Yang Yu, H. Felix Wu, Peter J. Shull, Andrew L. Gyekenyesi
PublisherSPIE
ISBN (Electronic)9781510608238
DOIs
StatePublished - 2017
EventConference on Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XI 2017 - Portland, United States
Duration: Mar 26 2017Mar 29 2017

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10169
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherConference on Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XI 2017
Country/TerritoryUnited States
CityPortland
Period3/26/173/29/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Keywords

  • Coefficient of Thermal Expansion
  • Fiber Optics
  • Structural Health Monitoring
  • Thermal Effects

Fingerprint

Dive into the research topics of 'Evaluating the coefficient of thermal expansion using time periods of minimal thermal gradient for a temperature driven structural health monitoring'. Together they form a unique fingerprint.

Cite this