Abstract
A novel air-cooled perforated micro-pin fin heat sink is designed and tested for efficient heat dissipation in electronic device. The heat sink features staggered arrangement of square solid micro-pin fins (edge length = 0.7 mm) made from copper, each with two strategically placed circular perforations of 350 μm and 450 μm. These perforations are fabricated through an advanced hybrid micro-manufacturing technique that combines high-speed micro-mechanical end milling and micro-EDM drilling. A heat flux of 20 kW/m2 is applied to the heat sink's base, and the resulting heat transfer enhancement and fluid dynamics are analysed with air as a coolant. The addition of two circular perforations enhances heat transfer by ≥48 % and reduces pressure drop by ≥11.84 %, primarily due to the decreased flow resistance. Experimental findings are complemented by numerical simulations utilizing conjugate heat transfer analysis to validate the operational characteristics of the micro-pin fin heat sink. This study aims to contribute to developing more effective thermal management solutions for high-power electronic devices.
| Original language | English (US) |
|---|---|
| Article number | 109640 |
| Journal | International Communications in Heat and Mass Transfer |
| Volume | 169 |
| DOIs | |
| State | Published - Dec 2025 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics
- General Chemical Engineering
- Condensed Matter Physics
Keywords
- Conjugate heat transfer
- Experimental analysis
- Heat transfer
- micro-EDM drilling
- Perforated micro-pin fins
- Thermal management
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