Enabling scalable hybrid systems: Architectures for exploiting large-area electronics in applications

Naveen Verma, Yingzhe Hu, Liechao Huang, Warren S.A. Rieutort-Louis, Josue Sanz Robinson, Tiffany Moy, Branko Glisic, Sigurd Wagner, James C. Sturm

Research output: Contribution to journalArticle

41 Scopus citations

Abstract

By enabling diverse and large-scale transducers, large-area electronics raises the potential for electronic systems to interact much more extensively with the physical world than is possible today. This can substantially expand the scope of applications, both in number and in value. But first, translation into applications requires a base of system functions (instrumentation, computation, power management, communication). These cannot be realized on the desired scale by large-area electronics alone. It is necessary to combine large-area electronics with high-performance, high-efficiency technologies, such as crystalline silicon CMOS, within hybrid systems. Scalable hybrid systems require rethinking the subsystem architectures from the start by considering how the technologies should be interfaced, on both a functional and physical level. To explore platform architectures along with the supporting circuits and devices, we consider as an application driver, a self-powered sheet for high-resolution structural health monitoring (of bridges and buildings). Top-down evaluation of design alternatives within the hybrid design space and pursuit of template architectures exposes circuit functions and device optimizations traditionally overlooked by bottom-up approaches alone.

Original languageEnglish (US)
Article number7110435
Pages (from-to)690-712
Number of pages23
JournalProceedings of the IEEE
Volume103
Issue number4
DOIs
StatePublished - Apr 1 2015

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Keywords

  • CMOS technology
  • Civil engineering computing
  • design for environment
  • display devices
  • electric sensing devices
  • electromagnetic coupling
  • embedded systems
  • energy harvesting
  • flexible electronics
  • inductive power transfer
  • integrated circuit interconnects
  • internet of things
  • large-scale systems
  • power electronics
  • sensors
  • thin film devices

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