TY - JOUR
T1 - Emerging devices and packaging strategies for electronic-photonic AI accelerators
T2 - opinion
AU - Peserico, Nicola
AU - de Lima, Thomas Ferreira
AU - Prucnal, Paul
AU - Sorger, Volker J.
N1 - Publisher Copyright:
© 2022 Optica Publishing Group
PY - 2022/4/1
Y1 - 2022/4/1
N2 - The field of mimicking the structure of the brain on a chip is experiencing interest driven by the demand for machine intelligent applications. However, the power consumption and available performance of machine-learning (ML) accelerating hardware still leave much desire for improvement. In this letter, we share viewpoints, challenges, and prospects of electronic-photonic neural network (NN) accelerators. Combining electronics with photonics offers synergistic co-design strategies for high-performance AI Application-specific integrated circuits (ASICs) and systems. Taking advantages of photonic signal processing capabilities and combining them with electronic logic control and data storage is an emerging prospect. However, the optical component library leaves much to be desired and is challenged by the enormous size of photonic devices. Within this context, we will review the emerging electro-optic materials, functional devices, and systems packaging strategies that, when realized, provide significant performance gains and fuel the ongoing AI revolution, leading to a stand-alone photonics-inside AI ASIC ‘black-box’ for streamlined plug-and-play board integration in future AI processors.
AB - The field of mimicking the structure of the brain on a chip is experiencing interest driven by the demand for machine intelligent applications. However, the power consumption and available performance of machine-learning (ML) accelerating hardware still leave much desire for improvement. In this letter, we share viewpoints, challenges, and prospects of electronic-photonic neural network (NN) accelerators. Combining electronics with photonics offers synergistic co-design strategies for high-performance AI Application-specific integrated circuits (ASICs) and systems. Taking advantages of photonic signal processing capabilities and combining them with electronic logic control and data storage is an emerging prospect. However, the optical component library leaves much to be desired and is challenged by the enormous size of photonic devices. Within this context, we will review the emerging electro-optic materials, functional devices, and systems packaging strategies that, when realized, provide significant performance gains and fuel the ongoing AI revolution, leading to a stand-alone photonics-inside AI ASIC ‘black-box’ for streamlined plug-and-play board integration in future AI processors.
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U2 - 10.1364/OME.451802
DO - 10.1364/OME.451802
M3 - Review article
AN - SCOPUS:85127581351
SN - 2159-3930
VL - 12
SP - 1347
EP - 1351
JO - Optical Materials Express
JF - Optical Materials Express
IS - 4
ER -