TY - JOUR
T1 - Electronic structure and carrier transport at laminated polymer homojunctions
AU - Shu, Andrew L.
AU - Dai, An
AU - Wang, He
AU - Loo, Yueh Lin
AU - Kahn, Antoine
N1 - Funding Information:
Support of this work by the US Department of Energy, Office of Basic Science, Division of Materials Sciences and Engineering under Award # DE-FG02-04ER46165 (AS), by the Princeton MRSEC of the National Science Foundation (DMR-0819860) and by a grant of the National Science Foundation (DMR-1005892) (AK) is gratefully acknowledged. HW and YLL also acknowledge funding from the Photovoltaics Program of ONR (N00014-11-10328). AS acknowledges helpful discussions on KPFM with the group of Prof. D. Ginger, Univ. of Washington.
PY - 2013/1
Y1 - 2013/1
N2 - Soft contact lamination, whereby films prepared separately from solution are brought into contact to form a single device, was used here to form homojunctions comprising two identical layers of poly(3-hexylthiophene) (P3HT) or two layers of poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(1,4-benzo-{2,1′- 3}-thiadiazole)] (F8BT). Using ultraviolet photoemission spectroscopy (UPS), Kelvin Probe Force Microscopy (KPFM), and current-voltage (I-V) measurements, the electronic structure of, and carrier transport across, these homojunctions were investigated. UPS and KPFM show that lamination does not introduce any significant offset in the molecular levels across the interface. The I-V characteristics confirm this result by showing that transport across the film is largely unaffected by the presence of the laminated interface. This important result means that lamination could become a versatile tool for constructing multi-layer polymer devices.
AB - Soft contact lamination, whereby films prepared separately from solution are brought into contact to form a single device, was used here to form homojunctions comprising two identical layers of poly(3-hexylthiophene) (P3HT) or two layers of poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(1,4-benzo-{2,1′- 3}-thiadiazole)] (F8BT). Using ultraviolet photoemission spectroscopy (UPS), Kelvin Probe Force Microscopy (KPFM), and current-voltage (I-V) measurements, the electronic structure of, and carrier transport across, these homojunctions were investigated. UPS and KPFM show that lamination does not introduce any significant offset in the molecular levels across the interface. The I-V characteristics confirm this result by showing that transport across the film is largely unaffected by the presence of the laminated interface. This important result means that lamination could become a versatile tool for constructing multi-layer polymer devices.
KW - Electronic structure
KW - F8BT
KW - P3HT
KW - Polymer-polymer interface
KW - Soft-contact lamination
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U2 - 10.1016/j.orgel.2012.09.023
DO - 10.1016/j.orgel.2012.09.023
M3 - Article
AN - SCOPUS:84870184261
SN - 1566-1199
VL - 14
SP - 149
EP - 155
JO - Organic Electronics
JF - Organic Electronics
IS - 1
ER -