Soft contact lamination, whereby films prepared separately from solution are brought into contact to form a single device, was used here to form homojunctions comprising two identical layers of poly(3-hexylthiophene) (P3HT) or two layers of poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(1,4-benzo-{2,1′- 3}-thiadiazole)] (F8BT). Using ultraviolet photoemission spectroscopy (UPS), Kelvin Probe Force Microscopy (KPFM), and current-voltage (I-V) measurements, the electronic structure of, and carrier transport across, these homojunctions were investigated. UPS and KPFM show that lamination does not introduce any significant offset in the molecular levels across the interface. The I-V characteristics confirm this result by showing that transport across the film is largely unaffected by the presence of the laminated interface. This important result means that lamination could become a versatile tool for constructing multi-layer polymer devices.

Original languageEnglish (US)
Pages (from-to)149-155
Number of pages7
JournalOrganic Electronics
Issue number1
StatePublished - Jan 2013

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • General Chemistry
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering


  • Electronic structure
  • F8BT
  • P3HT
  • Polymer-polymer interface
  • Soft-contact lamination


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