A technique is presented for making real-time, in situ measurements of film thickness profiles over local topography during spin coating. A laser is pulsed synchronously with the rotation of a spinning wafer to illuminate a microscope focused on a local feature being coated on the wafer. Interference fringes are captured photographically to allow observation of film thickness contours from initial spin-up to the final dried film. With this method we can observe the influcence of flow direction and microscopic feature shape and orientation on film profiles during the spinning and drying processes in spin coating.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)