Abstract
By introducing Si1-x-yGexCy, layers in vertical p-channel MOSFETs, boron diffusion from the source/drain regions into the channel region has been suppressed to enable sub-100 nm scaling. The trade-off of doped and undoped Si1-x-yGexCy layers has been studied. Due to detrimental effects from oxide grown on Si1-x-yGexCy layers, doped Si1-x-yGexCy diffusion barriers are preferable, and have allowed vertical p-channel MOSFETs with channel lengths down to 25 nm to be demonstrated. No excess leakage current due to the Si1-x-yGexCy layers is observed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 366-370 |
| Number of pages | 5 |
| Journal | Thin Solid Films |
| Volume | 369 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jul 3 2000 |
| Event | The International Joint Conference on Silicon Epitaxyand Heterostructures (IJC-SI) - Miyagi, Jpn Duration: Sep 12 1999 → Sep 17 1999 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry