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Continuum models for the contact line problem
Weiqing Ren, Dan Hu,
Weinan E
Mathematics
Research output
:
Contribution to journal
›
Article
›
peer-review
75
Scopus citations
Overview
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Chemical Compounds
Scaling Law
100%
Lubrication
78%
Surface Potential
76%
Dissipation
75%
Spreading
73%
Molecular Dynamics
51%
Force
47%
Thermodynamics
42%
Energy
32%
Surface
22%
Mathematics
Contact Line
99%
Continuum Model
90%
Wetting
49%
Boundary conditions
45%
Lubrication Approximation
28%
Surface Potential
26%
Molecular Dynamics
23%
Scaling Laws
22%
Energy Dissipation
22%
Thin Films
21%
Form
21%
Thermodynamics
18%
Partial
11%
Numerical Results
11%
Range of data
10%
Model
5%
Physics & Astronomy
continuums
50%
boundary conditions
39%
wetting
26%
lubrication
15%
solid surfaces
14%
scaling laws
13%
electric contacts
12%
energy dissipation
11%
molecular dynamics
10%
thermodynamics
9%
approximation
7%
thin films
7%
Engineering & Materials Science
Boundary conditions
42%
Wetting
28%
Surface potential
18%
Scaling laws
17%
Molecular dynamics
15%
Thin films
13%
Lubrication
13%
Thermodynamics
11%
Energy dissipation
11%