Conductive copper patterns by an additive, solventless, contact printing technique

Kimberly Felmet, Yangming Sun, Yueh Lin Loo

Research output: Contribution to conferencePaper

Abstract

An alternative copper patterning technique, nanotransfer printing, that is purely additive, solventless, and can be carried out at ambient conditions, was investigated. Deposition of copper onto the raised and recessed regions of the poly(dimethylsiloxane) (PDMS) stamp occurs by e-beam evaporations. Instantaneous reaction between the unreacted thiol endgroups of octanedithiol and copper occurs at the interface resulting in permanent copper attachment to the GaAs substrate. Preliminary AFM investigation of the printed metal surfaces indicated that PDMS oligomers might be able to permeate between individual copper grains thereby disrupting the percolative pathway of conduction.

Original languageEnglish (US)
Pages2431-2433
Number of pages3
StatePublished - Dec 1 2004
Externally publishedYes
Event2004 AIChE Annual Meeting - Austin, TX, United States
Duration: Nov 7 2004Nov 12 2004

Other

Other2004 AIChE Annual Meeting
CountryUnited States
CityAustin, TX
Period11/7/0411/12/04

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Felmet, K., Sun, Y., & Loo, Y. L. (2004). Conductive copper patterns by an additive, solventless, contact printing technique. 2431-2433. Paper presented at 2004 AIChE Annual Meeting, Austin, TX, United States.