Conductive copper patterning by nanotransfer printing

Kimberly Felmet, Yangming Sun, Yueh Lin Loo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A solventless, additive approach for patterning conductive copper in the 1-100μm range at ambient conditions is investigated. The patterning process is used for transferring copper from the raised regions of a stamp onto a GaAs substrate. The X-ray photoelectron spectroscopy (XPS) depth profiling experiments are performed on printed gold and copper patterns to understand the apparent discrepancy between gold and copper printing. The gold patterns printed with slygard 184 stamps are always conductive with resistivities comparable to those evaporated gold films of the same thickness.

Original languageEnglish (US)
Title of host publicationDevice Research Conference - Conference Digest, 62nd DRC
Pages91-92
Number of pages2
DOIs
StatePublished - Dec 1 2004
Externally publishedYes
EventDevice Research Conference - Conference Digest, 62nd DRC - Notre Dame, IN, United States
Duration: Jun 21 2004Jun 23 2004

Publication series

NameDevice Research Conference - Conference Digest, DRC
ISSN (Print)1548-3770

Other

OtherDevice Research Conference - Conference Digest, 62nd DRC
CountryUnited States
CityNotre Dame, IN
Period6/21/046/23/04

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Felmet, K., Sun, Y., & Loo, Y. L. (2004). Conductive copper patterning by nanotransfer printing. In Device Research Conference - Conference Digest, 62nd DRC (pp. 91-92). [III.-20] (Device Research Conference - Conference Digest, DRC). https://doi.org/10.1109/DRC.2004.1367798