TY - GEN
T1 - Conductive copper patterning by nanotransfer printing
AU - Felmet, Kimberly
AU - Sun, Yangming
AU - Loo, Yueh Lin
PY - 2004
Y1 - 2004
N2 - A solventless, additive approach for patterning conductive copper in the 1-100μm range at ambient conditions is investigated. The patterning process is used for transferring copper from the raised regions of a stamp onto a GaAs substrate. The X-ray photoelectron spectroscopy (XPS) depth profiling experiments are performed on printed gold and copper patterns to understand the apparent discrepancy between gold and copper printing. The gold patterns printed with slygard 184 stamps are always conductive with resistivities comparable to those evaporated gold films of the same thickness.
AB - A solventless, additive approach for patterning conductive copper in the 1-100μm range at ambient conditions is investigated. The patterning process is used for transferring copper from the raised regions of a stamp onto a GaAs substrate. The X-ray photoelectron spectroscopy (XPS) depth profiling experiments are performed on printed gold and copper patterns to understand the apparent discrepancy between gold and copper printing. The gold patterns printed with slygard 184 stamps are always conductive with resistivities comparable to those evaporated gold films of the same thickness.
UR - http://www.scopus.com/inward/record.url?scp=18044383307&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=18044383307&partnerID=8YFLogxK
U2 - 10.1109/DRC.2004.1367798
DO - 10.1109/DRC.2004.1367798
M3 - Conference contribution
AN - SCOPUS:18044383307
SN - 0780382846
T3 - Device Research Conference - Conference Digest, DRC
SP - 91
EP - 92
BT - Device Research Conference - Conference Digest, 62nd DRC
T2 - Device Research Conference - Conference Digest, 62nd DRC
Y2 - 21 June 2004 through 23 June 2004
ER -