COMBINING MULTI-LEVEL DECOMPOSITION AND TOPOLOGICAL PARTITIONING FOR PLAS.

Sharad Malik, R. H. Katz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

A design tool called PLASTIC is presented which combines the space-saving advantages of multilevel decomposition are combined with logic minimization, topological partitioning, and a compact PLA layout style. It avoids the need for the logic designer to hand-partition a large and slow monolithic PLA, and automatically generates area-efficient multilevel PLAs. Initial results for PLASTIC show area savings of up to 40%.

Original languageEnglish (US)
Title of host publicationUnknown Host Publication Title
PublisherIEEE
Pages112-115
Number of pages4
ISBN (Print)0818608145
StatePublished - Dec 1 1987
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Malik, S., & Katz, R. H. (1987). COMBINING MULTI-LEVEL DECOMPOSITION AND TOPOLOGICAL PARTITIONING FOR PLAS. In Unknown Host Publication Title (pp. 112-115). IEEE.