Collaborative platform, tool-kit, and physical models for DfM

Andy Neureuther, Wojtek Poppe, Juliet Holwill, Eric Chin, Lynn Wang, Jae Seok Yang, Marshai Miller, Dan Ceperley, Chris Clifford, Koji Kikuchi, Jihong Choi, Dave Dornfeld, Paul Friedberg, Costas Spanos, John Hoang, Jane Chang, Jerry Hsu, David Graves, Alan C.F. Wu, Mike Lieberman

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Exploratory prototype DfM tools, methodologies and emerging physical process models are described. The examples include new platforms for collaboration on process/device/circuits, visualization and quantification of manufacturing effects at the mask layout level, and advances toward fast-CAD models for lithography, CMP, etch and photomasks. The examples have evolved from research supported over the last several years by DARPA, SRC, Industry and the Sate of California U.C. Discovery Program. DfM tools must enable complexity management with very fast first-cut accurate models across process, device and circuit performance with new modes of collaboration. Collaborations can be promoted by supporting simultaneous views in naturally intuitive parameters for each contributor. An important theme is to shift the view point of the statistical variation in timing and power upstream from gate level CD distributions to a more deterministic set of sources of variations in characterized processes. Many of these nonidealities of manufacturing can be expressed at the mask plane in terms of lateral impact functions to capture effects not included in design rules. Pattern Matching and Perturbation Formulations are shown to be well suited for quantifying these sources of variation.

Original languageEnglish (US)
Title of host publicationDesign for Manufacturability through Design-Process Integration
StatePublished - 2007
Externally publishedYes
EventDesign for Manufacturability through Design-Process Integration - San Jose, CA, United States
Duration: Feb 28 2007Mar 2 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


ConferenceDesign for Manufacturability through Design-Process Integration
Country/TerritoryUnited States
CitySan Jose, CA

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


  • Aberrations
  • CMP
  • Design for Manufacturability (DfM)
  • Etch
  • Linewidth variation
  • Masks
  • Metrology
  • Optical imaging
  • Pattern matching
  • Signal integrity
  • Spillover
  • Timing


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