Abstract
The confinement of carriers in a MOS-gated GexSi1-x heterostructure is numerically modeled and experimentally confirmed. The structure, which may be useful for improved pMOS device performance, uses a MOS gate to modulate the hole density at a buried Si/GexSi1-x interface. Numerical modeling is used to predict the maximum number of carriers achievable at the interface as a function of the structure design, and clear experimental evidence for such carrier confinement is given. Simulations have shown that it is desirable to use a minimal Si buffer thickness and a maximum Ge fraction to maximize the number of holes confined in the GexSi1-x well, subject to the constraints of surface scattering and processing considerations.
Original language | English (US) |
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Pages (from-to) | 383-386 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
State | Published - Dec 1990 |
Event | 1990 International Electron Devices Meeting - San Francisco, CA, USA Duration: Dec 9 1990 → Dec 12 1990 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Materials Chemistry
- Electrical and Electronic Engineering