Boron segregation and electrical properties in polycrystalline SiGeC

E. J. Stewart, M. S. Carroll, J. C. Sturm

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations


Previously, it has been reported that PMOS capacitors with heavily boron-doped polycrystalline SiGeC gates are less susceptible to boron penetration than those with poly Si gates [1]. Boron appears to accumulate in the poly SiGeC layers during anneals, reducing boron outdiffusion from the gate despite high boron levels in the poly SiGeC at the gate/oxide interface. In this abstract, we report clear evidence of strong boron segregation to polycrystalline SiGeC layers from poly Si, with boron concentration in poly SiGeC (Ge=25%, C=1.5%) increasing to four times that of adjacent poly Si layers. A separate experiment confirms that this result is not due to any SIMS artifacts. Electrical measurements of heavily in-situ doped single layer samples show that the conductivity of poly SiGeC is similar to poly Si and remains roughly constant with annealing at 800°C. However, in a two-layer sample where the poly SiGeC is initially lightly doped and subsequently heavily doped by diffusion by from an adjacent poly Si layer, conductivity appears lower than in poly Si.

Original languageEnglish (US)
Pages (from-to)J691-J696
JournalMaterials Research Society Symposium - Proceedings
StatePublished - 2001
EventSi Front-end Processing - Physics and Technology of Dopant-Defect Interactions III - San Francisco, CA, United States
Duration: Apr 17 2001Apr 19 2001

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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