TY - GEN
T1 - Artificial intelligence meets large-scale sensing
T2 - 2018 IEEE Custom Integrated Circuits Conference, CICC 2018
AU - Ozatay, M.
AU - Aygun, L.
AU - Jia, H.
AU - Kumar, P.
AU - Mehlman, Y.
AU - Wu, C.
AU - Wagner, S.
AU - Sturm, J. C.
AU - Verma, N.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5/9
Y1 - 2018/5/9
N2 - The tremendous value artificial intelligence (AI) is showing across a broad range of applications is driving it from cyber-systems to systems pervading every aspect of our lives. But real-world data challenges the efficiency and robustness with which AI systems of today can perform, due to the highly dynamic and noisy scenarios they face. While algorithmic solutions are required, this paper also explores technological solutions based on large-scale sensing. Specifically, Large-Area Electronics (LAE) is a technology that can make large-scale, form-fitting sensors possible for broad deployment in our lives. System-design principles, architectural approaches, supporting circuits, and underlying technological concerns surrounding LAE and its use in emerging systems for intelligent sensing are explored.
AB - The tremendous value artificial intelligence (AI) is showing across a broad range of applications is driving it from cyber-systems to systems pervading every aspect of our lives. But real-world data challenges the efficiency and robustness with which AI systems of today can perform, due to the highly dynamic and noisy scenarios they face. While algorithmic solutions are required, this paper also explores technological solutions based on large-scale sensing. Specifically, Large-Area Electronics (LAE) is a technology that can make large-scale, form-fitting sensors possible for broad deployment in our lives. System-design principles, architectural approaches, supporting circuits, and underlying technological concerns surrounding LAE and its use in emerging systems for intelligent sensing are explored.
KW - Artificial intelligence
KW - Internet of Things
KW - flexible electronics
KW - large-area electronics
KW - machine learning
UR - http://www.scopus.com/inward/record.url?scp=85048143986&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048143986&partnerID=8YFLogxK
U2 - 10.1109/CICC.2018.8357031
DO - 10.1109/CICC.2018.8357031
M3 - Conference contribution
AN - SCOPUS:85048143986
T3 - 2018 IEEE Custom Integrated Circuits Conference, CICC 2018
SP - 1
EP - 8
BT - 2018 IEEE Custom Integrated Circuits Conference, CICC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 8 April 2018 through 11 April 2018
ER -