Application of laser direct-write techniques for embedding electronic and micropower components

Significant reduction in weight and volume for a given circuit design can be obtained by embedding the required surface mount devices, bare die and power source elements into the circuit board. In addition, embedded structures allow for improved electrical performance and enhanced function integration within traditional circuit board substrates and non-traditional surfaces such as the external case. Laser-based direct-write techniques can be used for developing such embedded structures at a fraction of the cost and in less time that it would take to develop system-on-chip alternatives such as ASIC's. Laser micromachining has been used in the past to machine vias and trenches on circuit board substrates with great precision, while laser forward transfer has been used to deposit patterns and multilayers of various electronic materials. This paper describes recent work performed at the Naval Research Laboratory using the above laser direct-write techniques to machine the surface and deposit the materials required to embed, connect and encapsulate individual electronic components and microbatteries inside a plastic substrate.