TY - GEN
T1 - Amorphous silicon thin film transistor backplanes fabricated at high temperature for flexible displays
AU - Cheng, I. Chun
AU - Wagner, Sigurd
AU - Kattamis, Alexis Z.
AU - Hekmatshoar, Bahman
AU - Cherenack, Kunigunde H.
AU - Gleskova, Helena
AU - Sturm, James Christopher
PY - 2007/12/1
Y1 - 2007/12/1
N2 - We describe the fabrication at high temperature of a-Si:H thin-film transistors and arrays for flexible backplanes on plastic or steel foil substrates. Plastic substrates of high-temperature processable clear polymers with low coefficient of thermal expansion and stainless steel are used. Asfabricated performance and bias-stress stability of transistors made at 150°C to 280°C are compared. Performance and stability like on glass are achieved. Dimensional stability of plastic substrates remains an issue that can be partially addressed by techniques for self-alignment. Stainless steel foil substrates offer high temperature tolerance and high dimensional stability, but must be carefully planarized electrically insulated prior to backplane fabrication.
AB - We describe the fabrication at high temperature of a-Si:H thin-film transistors and arrays for flexible backplanes on plastic or steel foil substrates. Plastic substrates of high-temperature processable clear polymers with low coefficient of thermal expansion and stainless steel are used. Asfabricated performance and bias-stress stability of transistors made at 150°C to 280°C are compared. Performance and stability like on glass are achieved. Dimensional stability of plastic substrates remains an issue that can be partially addressed by techniques for self-alignment. Stainless steel foil substrates offer high temperature tolerance and high dimensional stability, but must be carefully planarized electrically insulated prior to backplane fabrication.
UR - http://www.scopus.com/inward/record.url?scp=56049104967&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=56049104967&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:56049104967
SN - 9789572852248
T3 - IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings
SP - 311
EP - 314
BT - IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings
T2 - International Display Manufacturing Conference and Exhibition, IDMC 2007
Y2 - 3 July 2007 through 6 July 2007
ER -