@inproceedings{cc514974606e45c39316822e14b601e4,
title = "Amorphous silicon thin film transistor backplanes fabricated at high temperature for flexible displays",
abstract = "We describe the fabrication at high temperature of a-Si:H thin-film transistors and arrays for flexible backplanes on plastic or steel foil substrates. Plastic substrates of high-temperature processable clear polymers with low coefficient of thermal expansion and stainless steel are used. Asfabricated performance and bias-stress stability of transistors made at 150°C to 280°C are compared. Performance and stability like on glass are achieved. Dimensional stability of plastic substrates remains an issue that can be partially addressed by techniques for self-alignment. Stainless steel foil substrates offer high temperature tolerance and high dimensional stability, but must be carefully planarized electrically insulated prior to backplane fabrication.",
author = "Cheng, {I. Chun} and Sigurd Wagner and Kattamis, {Alexis Z.} and Bahman Hekmatshoar and Cherenack, {Kunigunde H.} and Helena Gleskova and Sturm, {James C.}",
year = "2007",
language = "English (US)",
isbn = "9789572852248",
series = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",
pages = "311--314",
booktitle = "IDMC 2007 - International Display Manufacturing Conference and FPD Expo - Proceedings",
note = "International Display Manufacturing Conference and Exhibition, IDMC 2007 ; Conference date: 03-07-2007 Through 06-07-2007",
}