AlGaN/GaN HEMTs grown by MBE on semi-insulating HVPE GaN templates

N. G. Weimann, M. J. Manfra, J. W.P. Hsu, L. N. Pfeiffer, K. W. West, D. V. Lang, R. J. Molnar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Summary form only given. Attempts to circumvent the low thermal conductivity of sapphire substrates by including in a device structure a thick (15 μm) GaN buffer grown by HVPE between the sapphire substrate and the MBE device layer stack. The heat generated in the device close to the surface of the structure is spread laterally in the HVPE buffer, increasing the effective thermal area of the device, and lowering the thermal impedance of the HEMT device. In contrast to SiC, the sapphire substrate technology is mature and affordable. Principally, both MBE and HVPE growth may be scaled up in area to grow on readily available large diameter sapphire substrates.

Original languageEnglish (US)
Title of host publication60th Device Research Conference, DRC 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages33
Number of pages1
ISBN (Electronic)0780373170
DOIs
StatePublished - 2002
Externally publishedYes
Event60th Device Research Conference, DRC 2002 - Santa Barbara, United States
Duration: Jun 24 2002Jun 26 2002

Publication series

NameDevice Research Conference - Conference Digest, DRC
Volume2002-January
ISSN (Print)1548-3770

Other

Other60th Device Research Conference, DRC 2002
Country/TerritoryUnited States
CitySanta Barbara
Period6/24/026/26/02

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Keywords

  • Aluminum gallium nitride
  • Gallium nitride
  • HEMTs
  • MODFETs

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