Abstract
Flexible displays fabricated using plastic substrates have a potential for being very thin, light weight, highly rugged with greatly minimized propensity for breakage, roll-to-roll manufacturing and lower cost. The emerging OLED display media offers the advantage of being a solid state and rugged structure for flexible displays in addition to the many potential advantages of an AM OLED over the currently dominant AM LCD. The current high level of interest in flexible displays is facilitating the development of the required enabling technologies which include development of plastic substrates, low temperature active matrix device and backplane fabrication, and display packaging. In the following we will first discuss our development efforts in the PEN based plastic substrates, active matrix backplane technology, low temperature (150°C) a-Si TFT devices and an AM OLED test chip used for evaluating various candidate designs. We will then describe the design, fabrication and successful evaluation and demonstration of a 64×64 pixel AM OLED test display using a-Si TFT backplane fabricated at 150°C on the flexible plastic substrate.
Original language | English (US) |
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Pages (from-to) | 180-191 |
Number of pages | 12 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 5080 |
DOIs | |
State | Published - 2003 |
Event | Cockpit Displays X - Orlando, FL, United States Duration: Apr 22 2003 → Apr 25 2003 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Keywords
- 150°C a-Si TFT
- AM OLED
- Flexible AM OLED
- Flexible Active Matrix OLED
- Flexible Display
- Flexible TFT-OLED
- Organic Light Emitting Diode
- Plastic Dimensional Stability
- Plastic Display
- Plastic Substrate