Engineering & Materials Science
Etching
100%
Chemical activation
83%
Atoms
40%
Molecules
37%
Fluorine
32%
Chemisorption
23%
Scattering
21%
Kinetic energy
16%
Molecular beams
13%
Angular distribution
12%
Silicon
12%
Data storage equipment
9%
Molecular dynamics
8%
Computer simulation
4%
Temperature
3%
Physics & Astronomy
activation
74%
etching
70%
reactivity
42%
fluorine
25%
molecules
22%
atoms
21%
chemisorption
18%
kinetic energy
13%
scattering
12%
energy
12%
simulation
9%
neutral beams
9%
silicon
9%
molecular beams
8%
surface temperature
8%
angular distribution
7%
disorders
6%
molecular dynamics
6%
products
5%
excitation
4%
Chemical Compounds
Etching
83%
Surface
29%
Dissociative Chemisorption
24%
Fluorine Atom
22%
Energy
19%
Kinetic Energy
19%
Simulation
16%
Molecule
14%
Multi-Step Reaction
11%
Surface Temperature
11%
Molecular Beam
10%
Disorder
7%
Molecular Dynamics
6%
Reaction Yield
3%
Application
2%