A Programmable Active THz Electromagnetic Surface on-Chip for Multi-functional Imaging

Xue Wu, Huaixi Lu, Xuyang Lu, Kaushik Sengupta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

An integrated THz imager is proposed with an actively reconfigurable electromagnetic interface that can engineer the surface reception properties to reconfigure its sensitivity and aperture for three incident field properties, namely frequency, polarization and incident angle. The chip realized in a 65 nm CMOS process achieves upto 15x enhancement in responsivity and NEP across 0.1-0.99 THz and enables a programmable and versatile THz interface for hyperspectral, multi-angle and multi-polarization imaging.

Original languageEnglish (US)
Title of host publicationProceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1464-1467
Number of pages4
ISBN (Print)9781538650677
DOIs
StatePublished - Aug 17 2018
Event2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 - Philadelphia, United States
Duration: Jun 10 2018Jun 15 2018

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2018-June
ISSN (Print)0149-645X

Other

Other2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
CountryUnited States
CityPhiladelphia
Period6/10/186/15/18

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Reconfigurable
  • THz imaging
  • electromagnetic interface
  • incident angle
  • polarization

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  • Cite this

    Wu, X., Lu, H., Lu, X., & Sengupta, K. (2018). A Programmable Active THz Electromagnetic Surface on-Chip for Multi-functional Imaging. In Proceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 (pp. 1464-1467). [8439481] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2018-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2018.8439481