Seeding polymer substrates for the attachment and growth of metallic contacts is an important problem in modern microcircuit fabrication. A new method to effect such polymer metallization is described in which the polymer is first treated with vapor of zirconium or titanium tetra-tert-butoxide and then thermalyzed to give several monolayers of zirconium or titanium oxides that are attached to the polymer surfaces. The thickness of this layer can be controlled by the vapor exposure time. The thin oxide layers withstand removal by strenuous flexing of the polymers, and they absorb copper sulfate from an aqueous solution. Upon simple treatment with dialkylaminoborane or sodium borohydride, the polymer is metallized with copper. The tetra-tert-butoxides can be deposited through a mask, and patterned metallization of the polymers is easily accomplished.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- adhesion layer
- polymer metallization