Abstract
Large-area electronics (LAE) enables diverse transducers on large, flexible substrates (∼10m2), making possible expansive sensor arrays and energy harvesting devices. We present a second-generation system for high-resolution structural-health monitoring of bridges achieved by combining LAE with CMOS ICs in a scalable architecture. It aims to enable strain sensing scalable down to cm-resolution over the large-area sheets. Compared to previous work [1], the system presents several advances, including self-powered operation with embedded energy harvesting, generalized readout and control interfaces for sensor arrays based on thin-film transistors (TFTs), and full integration of instrumentation and communication circuits for multi-sensor acquisition, digitization, and self calibration. The instrumentation subsystem achieves multi-channel strain sensing with sensitivity of 23μStrainRMS, at an energy/measurement of 148nJ and 286nJ for readout and sensor-access control, respectively. The power-management subsystem achieves 30% efficiency for power inversion and inductive power delivery using a thin-film harvesting circuit with a solar module, and 80.5% overall efficiency for generating three voltage supplies via CMOS DC-DC converters.
Original language | English (US) |
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Title of host publication | 2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers |
State | Published - Sep 17 2013 |
Event | 2013 Symposium on VLSI Circuits, VLSIC 2013 - Kyoto, Japan Duration: Jun 12 2013 → Jun 14 2013 |
Other
Other | 2013 Symposium on VLSI Circuits, VLSIC 2013 |
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Country | Japan |
City | Kyoto |
Period | 6/12/13 → 6/14/13 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering