@inproceedings{e4bfe020f2fb4390aa96ce6d48fc5feb,
title = "A co-design study of fusion whole device modeling using code coupling",
abstract = "Complex workflows consisting of multiple simulation and analysis codes running concurrently through in-memory coupling is becoming popular due to inherent advantages in online management of large-scale data, resilience, and the code development process. However, orchestrating such a multi-application workflow to efficiently utilize resources on a heterogeneous architecture is challenging. In this paper, we present our results with running the Fusion Whole Device Modeling benchmark workflow on Summit, a pre-exascale supercomputer at Oak Ridge National Laboratory. We explore various resource distribution and process placement mechanisms, including sharing compute nodes between processes from separate applications. We show that fine-grained process placement can have a significant impact towards efficient utilization of the compute power of a node on Summit, and conclude that sophisticated tools for performing co-design studies of multi-application workflows can play an important role towards efficient orchestration of such workflows.",
keywords = "Co-design, Coupling, Fusion, Summit, Whole device model, Workflow",
author = "Choi, \{Jong Youl\} and Matthew Wolf and Scott Klasky and Jeremy Logan and Kshitij Mehta and Eric Suchyta and William Godoy and Nick Thompson and Lipeng Wan and Jieyang Chen and Norbert Podhorszki and Julien Dominski and Chang, \{Choong Seock\}",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 5th IEEE/ACM International Workshop on Data Analysis and Reduction for Big Scientific Data, DRBSD-5 2019 ; Conference date: 17-11-2019",
year = "2019",
month = nov,
doi = "10.1109/DRBSD-549595.2019.00011",
language = "English (US)",
series = "Proceedings of DRBSD-5 2019: 5th International Workshop on Data Analysis and Reduction for Big Scientific Data - Held in conjunction with SC 2019: The International Conference for High Performance Computing, Networking, Storage and Analysis",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "35--41",
booktitle = "Proceedings of DRBSD-5 2019",
address = "United States",
}