TY - GEN
T1 - A 256-kb Fully Row/Column-parallel 22nm MRAM In-Memory-Computing Macro with Differential Readout for Robust Parallelization and Scale-up
AU - Deaville, Peter
AU - Zhang, Bonan
AU - Verma, Naveen
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper presents a 256-kb in-memory computing (IMC) macro implemented in 22nm CMOS with foundry MRAM. IMC leverages high levels of parallelism (both rows/columns within macro and multiple macros across chip), but where previous architectures have not addressed the data-dependent interference/noise between highly sensitive parallel analog circuits. Here, an IMC macro with differential readout architecture is demonstrated, which retains high energy efficiency, while overcoming the power-supply interference between the many parallel readout channels. High-sensitivity conductance-to-current readout is demonstrated, without relying on non-standard foundry cells, having atypical cell-state resistances or non-standard array configurations, and without relying on reduced row/column parallelism. The macro achieves state-of-the-art energy efficiency of 28.0-68.6 lb-TOPS/W and compute density of 5.43 1b-TOPS/mm2. CIFAR-10 classification is demonstrated, achieving software iso-accuracy of 90.25%, with all convolutional layers mapped to the chip.
AB - This paper presents a 256-kb in-memory computing (IMC) macro implemented in 22nm CMOS with foundry MRAM. IMC leverages high levels of parallelism (both rows/columns within macro and multiple macros across chip), but where previous architectures have not addressed the data-dependent interference/noise between highly sensitive parallel analog circuits. Here, an IMC macro with differential readout architecture is demonstrated, which retains high energy efficiency, while overcoming the power-supply interference between the many parallel readout channels. High-sensitivity conductance-to-current readout is demonstrated, without relying on non-standard foundry cells, having atypical cell-state resistances or non-standard array configurations, and without relying on reduced row/column parallelism. The macro achieves state-of-the-art energy efficiency of 28.0-68.6 lb-TOPS/W and compute density of 5.43 1b-TOPS/mm2. CIFAR-10 classification is demonstrated, achieving software iso-accuracy of 90.25%, with all convolutional layers mapped to the chip.
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U2 - 10.1109/ESSCIRC59616.2023.10268799
DO - 10.1109/ESSCIRC59616.2023.10268799
M3 - Conference contribution
AN - SCOPUS:85175261063
T3 - European Solid-State Circuits Conference
SP - 21
EP - 24
BT - ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference
PB - IEEE Computer Society
T2 - 49th IEEE European Solid State Circuits Conference, ESSCIRC 2023
Y2 - 11 September 2023 through 14 September 2023
ER -