17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

Levent E. Aygun, Prakhar Kumar, Zhiwu Zheng, Ting Sheng Chen, Sigurd Wagner, James Christopher Sturm, Naveen Verma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Tactile sensing has wide-ranging applications, from intelligent surfaces to advanced robotics. Large-Area Electronics (LAE), based on low-temp. fabrication (< 200 {circ} {C}) of thin films, presents distinct capabilities, due to compatibility with a broad range of materials (enabling diverse transducers), as well as large and flexible substrates and materials-deposition methods (enabling expansive and formfitting sensing arrays). However, low performance/energy-efficiency of LAE thin-film transistors (TFTs) necessitates hybrid systems, integrating Si-CMOS ICs for system functions (sensor readout/control, processing, etc.). Initial work shows that a primary challenge in hybrid systems is the large number of interfaces required between LAE and CMOS, particularly as the number of sensors scales [1], [2]. This paper presents a force-sensing system that exploits signal sparsity exhibited in many large-area tactile-sensing applications (e.g., detecting point damage/stress in structures [3]), to reduce interfacing complexity to the level of sparsity, rather than a level related to the number of sensors (e.g., [1]). This is achieved via compressed sensing (CS), enabling sensor-acquisition by simple switches, readily implemented using TFTs. While CS has previously been leveraged in a hybrid-system architecture targeting signal sampling-rate requirements [2], this system applies it for high spatial resolution in tactile sensing.

Original languageEnglish (US)
Title of host publication2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages280-282
Number of pages3
ISBN (Electronic)9781538685310
DOIs
StatePublished - Mar 6 2019
Event2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 - San Francisco, United States
Duration: Feb 17 2019Feb 21 2019

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume2019-February
ISSN (Print)0193-6530

Conference

Conference2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
CountryUnited States
CitySan Francisco
Period2/17/192/21/19

Fingerprint

Compressed sensing
Thin film transistors
Hybrid systems
Skin
Electronic equipment
Sensors
Signal sampling
Energy efficiency
Transducers
Robotics
Switches
Fabrication
Thin films
Substrates
Processing

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C., & Verma, N. (2019). 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (pp. 280-282). [8662442] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2019.8662442
Aygun, Levent E. ; Kumar, Prakhar ; Zheng, Zhiwu ; Chen, Ting Sheng ; Wagner, Sigurd ; Sturm, James Christopher ; Verma, Naveen. / 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 280-282 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).
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abstract = "Tactile sensing has wide-ranging applications, from intelligent surfaces to advanced robotics. Large-Area Electronics (LAE), based on low-temp. fabrication (< 200 {circ} {C}) of thin films, presents distinct capabilities, due to compatibility with a broad range of materials (enabling diverse transducers), as well as large and flexible substrates and materials-deposition methods (enabling expansive and formfitting sensing arrays). However, low performance/energy-efficiency of LAE thin-film transistors (TFTs) necessitates hybrid systems, integrating Si-CMOS ICs for system functions (sensor readout/control, processing, etc.). Initial work shows that a primary challenge in hybrid systems is the large number of interfaces required between LAE and CMOS, particularly as the number of sensors scales [1], [2]. This paper presents a force-sensing system that exploits signal sparsity exhibited in many large-area tactile-sensing applications (e.g., detecting point damage/stress in structures [3]), to reduce interfacing complexity to the level of sparsity, rather than a level related to the number of sensors (e.g., [1]). This is achieved via compressed sensing (CS), enabling sensor-acquisition by simple switches, readily implemented using TFTs. While CS has previously been leveraged in a hybrid-system architecture targeting signal sampling-rate requirements [2], this system applies it for high spatial resolution in tactile sensing.",
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Aygun, LE, Kumar, P, Zheng, Z, Chen, TS, Wagner, S, Sturm, JC & Verma, N 2019, 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. in 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019., 8662442, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 2019-February, Institute of Electrical and Electronics Engineers Inc., pp. 280-282, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, San Francisco, United States, 2/17/19. https://doi.org/10.1109/ISSCC.2019.8662442

17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. / Aygun, Levent E.; Kumar, Prakhar; Zheng, Zhiwu; Chen, Ting Sheng; Wagner, Sigurd; Sturm, James Christopher; Verma, Naveen.

2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 280-282 8662442 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Aygun LE, Kumar P, Zheng Z, Chen TS, Wagner S, Sturm JC et al. 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 280-282. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). https://doi.org/10.1109/ISSCC.2019.8662442