TY - GEN
T1 - 12.2 3D gesture-sensing system for interactive displays based on extended-range capacitive sensing
AU - Hu, Yingzhe
AU - Huang, Liechao
AU - Rieutort-Louis, Warren
AU - Sanz-Robinson, Josue
AU - Wagner, Sigurd
AU - Sturm, James C.
AU - Verma, Naveen
PY - 2014
Y1 - 2014
N2 - Capacitive touch screens have enabled compelling interfaces for displays [1]. Three-dimensional (3D) sensing, where user gestures can also be sensed in the out-of-plane dimension to distances of 20 to 30cm, represents new interfacing possibilities that could substantially enrich user experience. The challenge is achieving sensitivity at these distances when sensing the small capacitive perturbations caused by user interaction with sensing electrodes. Among capacitive-sensing approaches, self capacitance enables substantially greater distance than mutual capacitance (i.e., between electrodes), but can suffer from ghost effects during multi-touch. For gesture recognition, however, processing via classifiers can overcome such effects, enabling a rich dictionary of gestures [2]. Nonetheless, the sensing distance of such systems has been too limited for 3D sensing.
AB - Capacitive touch screens have enabled compelling interfaces for displays [1]. Three-dimensional (3D) sensing, where user gestures can also be sensed in the out-of-plane dimension to distances of 20 to 30cm, represents new interfacing possibilities that could substantially enrich user experience. The challenge is achieving sensitivity at these distances when sensing the small capacitive perturbations caused by user interaction with sensing electrodes. Among capacitive-sensing approaches, self capacitance enables substantially greater distance than mutual capacitance (i.e., between electrodes), but can suffer from ghost effects during multi-touch. For gesture recognition, however, processing via classifiers can overcome such effects, enabling a rich dictionary of gestures [2]. Nonetheless, the sensing distance of such systems has been too limited for 3D sensing.
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U2 - 10.1109/ISSCC.2014.6757404
DO - 10.1109/ISSCC.2014.6757404
M3 - Conference contribution
AN - SCOPUS:84898079015
SN - 9781479909186
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 212
EP - 213
BT - 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
T2 - 2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
Y2 - 9 February 2014 through 13 February 2014
ER -