Calculated based on number of publications stored in Pure and citations from Scopus
1996 …2024

Research activity per year

Network

Sreeram Kannan

  • University of Washington
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign
  • University of Washington
  • Trifecta Blockchain
  • CSL
  • University of Washington
  • Samsung AI Center
  • University of Washington
  • Samsung
  • UNIVERSITY OF WASHINGTON
  • University of Illinois Urbana-Champaign
  • University of Washington

External person

Sewoong Oh

  • University of Washington
  • University of Washington
  • University of Michigan
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Washington
  • University of Washington
  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • University of Washington

External person

David Tse

  • University of California at Berkeley
  • Stanford University
  • Massachusetts Institute of Technology
  • Laboratory for Information and Decision Systems
  • Department of Electrical Engineering and Computer Sciences
  • EECS Department
  • IEEE
  • Stanford University

External person

Giulia Fanti

  • University of Illinois at Urbana-Champaign
  • Carnegie Mellon University
  • Giulia Fanti
  • CMU
  • University of California at Berkeley
  • University of Illinois Urbana-Champaign

External person

Hyeji Kim

  • Samsung AI Research
  • Samsung Ai Research Cambridge
  • Samsung AI Center
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Lab.
  • University of Washington
  • University of Texas at Austin
  • Samsung
  • University of Illinois Urbana-Champaign
  • Samsung Research

External person

Adnan Raja

  • University of Illinois at Urbana-Champaign
  • Fastback Networks
  • Fastback Networks, Inc.
  • Stanford University
  • University of Illinois Urbana-Champaign

External person

Peter Kairouz

  • Alphabet Inc.
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • Stanford University
  • University of Illinois Urbana-Champaign

External person

Shaileshh Bojja Venkatakrishnan

  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Vinod M. Prabhakaran

  • University of Illinois at Urbana-Champaign
  • Tata Institute of Fundamental Research
  • University of Illinois Urbana-Champaign

External person

Yihan Jiang

  • University of Washington
  • University of Washington
  • Aira Technologies
  • University of Washington

External person

Weihao Gao

  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Coordinated Science Lab.
  • University of Illinois Urbana-Champaign

External person

Venkat Anantharam

  • Cornell University
  • IEEE
  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Science

External person

Aaron B. Wagner

  • Cornell University
  • University of Illinois at Urbana-Champaign
  • School of Electrical and Computer Engineering
  • School of ECE
  • Ministry of Higher Education, Science, Research and Innovation
  • University of Illinois Urbana-Champaign

External person

Ashok Vardhan Makkuva

  • University of Illinois at Urbana-Champaign
  • University of Michigan
  • University of Michigan
  • EPFL
  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • Swiss Federal Institute of Technology Lausanne

External person

Saurabha Tavildar

  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois Urbana-Champaign

External person

Himanshu Asnani

  • Tata Institute of Fundamental Research
  • University of Washington

External person

Ranvir Rana

  • University of Illinois at Urbana-Champaign
  • Kaleidoscope Blockchain Inc.
  • University of Illinois Urbana-Champaign

External person

Tie Liu

  • Texas A&M University
  • Technion-Israel Institute of Technology
  • Electrical and Computer Engineering
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Texas A and M University
  • University of Illinois Urbana-Champaign

External person

Hua Wang

  • University of Illinois at Urbana-Champaign
  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign

External person

Quan Geng

  • Tower Research Capital, LLC
  • University of Illinois at Urbana-Champaign
  • Alphabet Inc.
  • UIUC
  • Tower Research Capital LLC
  • CSL

External person

Xuechao Wang

  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology

External person

Hongyu Gong

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Facebook
  • Meta

External person

Aleksandar Jovičić

  • University of Illinois at Urbana-Champaign
  • Qualcomm Incorporated
  • IEEE
  • University of Illinois Urbana-Champaign

External person

Himanshu Tyagi

  • Indian Institute of Science Bangalore
  • Kaleidoscope Blockchain Inc.

External person

Peiyao Sheng

  • University of Illinois at Urbana-Champaign
  • Kaleidoscope Blockchain Inc.

External person

Gerui Wang

  • University of Illinois at Urbana-Champaign
  • Beijing Academy of Blockchain and Edge Computing
  • Beijing Academy of Blockchain and Edge Computing
  • University of Illinois Urbana-Champaign

External person

Mingchao Yu

  • University of Southern California
  • University of Southern California

External person

Shun Watanabe

  • Tokyo University of Agriculture and Technology

External person

Sudeep Kamath

  • Princeton University
  • Department of Electrical Engineering
  • University of California at Berkeley
  • University of California at San Diego

External person

Jiaqi Mu

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Kannan Ramchandran

  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Science

External person

Songze Li

  • Trifecta Blockchain
  • University of Southern California
  • University of Southern California

External person

Mohammad Alizadeh

  • Massachusetts Institute of Technology

External person

Hessam Mahdavifar

  • University of Michigan
  • University of Michigan
  • University of Michigan, Ann Arbor
  • University of Michigan

External person

Xiyang Liu

  • University of Michigan
  • University of Washington
  • University of Michigan, Ann Arbor
  • University of Washington

External person

Chandra Chekuri

  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois Urbana-Champaign

External person

Ramachandran Rajesh

  • Defence Research and Development Organisation India

External person

Aleksandar Jovicic

  • University of Illinois at Urbana-Champaign
  • Dept. of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Univ of Illinois, Urbana, IL, USA
  • Qualcomm Incorporated

External person

Kartik Nayak

  • Duke University

External person

Vivek Bagaria

  • Stanford University
  • Matician
  • Stanford University

External person

S. Ashwin Hebbar

  • University of Illinois at Urbana-Champaign
  • Princeton University

External person

Sachin Katti

  • Open Network Foundation
  • MIT
  • Stanford University

External person

Vahid Jamali

  • Institute for Digital Communications at Friedrich-Alexander University Erlangen-Nürnberg (FAU). (e-mail:
  • Institute for Digital Communications at Friedrich-Alexander University Erlangen-Nürnberg (FAU
  • Friedrich-Alexander University Erlangen-Nürnberg
  • Princeton University
  • Technische Universität Darmstadt
  • University of Michigan, Ann Arbor

External person

Andrew Miller

  • University of Maryland, College Park
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • School of Engineering and Applied Sciences
  • University of Maryland
  • UIUC
  • UIUC

External person

Aurélie C. Lozano

  • Princeton University
  • IEEE
  • IBM
  • Department of Electrical Engineering
  • EE Department
  • Department of Electrical Engineering

External person

Thitidej Tularak

  • Cornell University
  • Ministry of Higher Education, Science, Research and Innovation

External person

Aggelos Kiayias

  • University of Edinburgh

External person

Benjamin G. Kelly

  • Cornell University
  • Birchbox, Inc

External person

A. Salman Avestimehr

  • University of Southern California
  • University of Southern California

External person

Sravan Kumar Ankireddy

  • University of Texas at Austin

External person

Vasuki Narasimha Swamy

  • Indian Institute of Technology Madras
  • University of California at Berkeley

External person

Saeid Sahraei

  • University of Southern California

External person

Chien Sheng Yang

  • University of Southern California
  • University of Southern California

External person

Bradley Denby

  • Carnegie Mellon University
  • CMU

External person

Nilesh Khude

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Sahand Haji Ali Ahmad

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Rajesh Sundaresan

  • IEEE
  • Princeton University
  • Indian Institute of Science Bangalore
  • Department of Electrical Engineering
  • Department of Electrical Communication Engineering
  • University of Illinois at Urbana-Champaign

External person

Ofer Zeitouni

  • New York University
  • Weizmann Institute of Science
  • Technion-Israel Institute of Technology
  • Princeton University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Mathematics

External person

Kanthi Nagaraj

  • Stanford University

External person

Salman Avestimehr

  • University of Southern California

External person

Yossef Steinberg

  • Ben-Gurion University of the Negev
  • Princeton University
  • George Mason University
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Technion-Israel Institute of Technology

External person

Rui Wu

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Amir Dembo

  • Stanford University
  • Departments of Statistics and Mathematics
  • Department of Statistics
  • Department of Mathematics

External person

Asaf Cidon

  • Columbia University
  • Stanford University

External person

Rajiv Laroia

  • Qualcomm Incorporated
  • IEEE

External person

Hanan Weingarten

  • Technion-Israel Institute of Technology

External person

V. Sharma

  • University of Delhi
  • University of California at San Diego
  • University of Illinois at Chicago
  • CERN
  • University of California at Riverside
  • Florida State University
  • University of Wisconsin-Madison
  • Computer Sciences Department
  • Indian Institute of Science Bangalore

External person

Yi Wang

  • Huawei Technologies Co., Ltd.

External person

Lizhong Zheng

  • Massachusetts Institute of Technology
  • MIT
  • Department of Electrical Engineering and Computer Science
  • Laboratory for Information and Decision Systems
  • Department of Electrical Engineering and Computer Science
  • Research Laboratory of Electronics
  • MIT
  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology

External person

Shlomo Shamai

  • Technion-Israel Institute of Technology
  • Princeton University
  • IEEE
  • University of Illinois at Chicago
  • Lucent
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering Technion
  • Dept. of EE
  • TechnionVIsrael Institute of Technology
  • Technion
  • Department of Electrical Engineering
  • Technion
  • Technion
  • Technion
  • Technion
  • Technion

External person

Dimitris Karakostas

  • University of Edinburgh

External person

Viswa Virinchi Muppirala

  • University of Washington

External person

Rajesh K. Mishra

  • University of Texas at Austin

External person

Jiantao Jiao

  • University of California at Berkeley

External person

Shuo Wang

  • Stanford University
  • Stanford University

External person

Lei Yang

  • Massachusetts Institute of Technology

External person

Tarek Sakakini

  • University of Illinois at Urbana-Champaign

External person

Srikrishna Bhashyam

  • Indian Institute of Technology Madras

External person

Changho Suh

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering
  • School of Electrical Engineering

External person

Vinod Sharma

  • Indian Institute of Science Bangalore

External person

Kannan Ramchandran

  • University of California at Berkeley

External person

Yuchen Li

  • University of Illinois at Urbana-Champaign

External person

Suhas Diggavi

  • Swiss Federal Institute of Technology Lausanne
  • University of California at Los Angeles
  • Swiss Federal Institute of Technology
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • EE Dept.
  • Swiss Federal Institute of Technology Zurich
  • School of Computer and Communication Sciences
  • University of California

External person

Mohammad Vahid Jamali

  • University of Michigan

External person

Suryanarayana Sankagiri

  • University of Illinois at Urbana-Champaign

External person

S. V.R. Anand

  • Kaleidoscope Blockchain Inc.

External person

Arman Rahimzamani

  • University of Washington

External person

Jiayin Zhang

  • Huawei Technologies Co., Ltd.

External person

Bowen Xue

  • University of Washington

External person

Milind Kumar Vaddiraju

  • Banyan Intelligence

External person

Nikos Leonardos

  • National and Kapodistrian University of Athens

External person

M. A.L. Thathachar

  • Indian Institute of Science Bangalore

External person

I. Hsiang Wang

  • Swiss Federal Institute of Technology Lausanne

External person

Kathleen Ruan

  • Carnegie Mellon University

External person

Vibhaalakshmi Sivaraman

  • Princeton University
  • Massachusetts Institute of Technology

External person

Leonid Kogan

  • National Bureau of Economic Research
  • Massachusetts Institute of Technology

External person

Serhat Arslan

  • Stanford University

External person

Viraj Nadkarni

  • Princeton University

External person

Xiaoyan Bi

  • Huawei Technologies Co., Ltd.

External person

Ertem Nusret Tas

  • Stanford University

External person

Rajat Chopra

  • Kaleidoscope Blockchain Inc.

External person

Sriram Rajamani

  • Microsoft USA
  • University of California at Berkeley

External person

Mua Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person