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2019

17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications

Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Analyzing and Increasing Yield of ZnO Thin-Film Transistors for Large-area Sensing Systems by Preventing Process-Induced Gate Dielectric Breakdown

Zheng, Z., Aygun, L. E., Mehlman, Y., Wagner, S., Verma, N. & Sturm, J. C., Jun 2019, 2019 Device Research Conference, DRC 2019. Institute of Electrical and Electronics Engineers Inc., p. 141-142 2 p. 9046406. (Device Research Conference - Conference Digest, DRC; vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing

Jia, H., Valavi, H., Tang, Y., Zhang, J. & Verma, N., Aug 2019, 2019 IEEE Hot Chips 31 Symposium, HCS 2019. Institute of Electrical and Electronics Engineers Inc., 8875632. (2019 IEEE Hot Chips 31 Symposium, HCS 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gigahertz Zinc-Oxide TFT-Based Oscillators

Mehlman, Y., Wu, C., Wagner, S., Verma, N. & Sturm, J. C., Jun 2019, 2019 Device Research Conference, DRC 2019. Institute of Electrical and Electronics Engineers Inc., p. 63-64 2 p. 9046405. (Device Research Conference - Conference Digest, DRC; vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Large area electronics based sensing sheet for strain monitoring and damage detection of bridges

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glišić, B., Jan 1 2019, Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring. Chang, F-K., Guemes, A. & Kopsaftopoulos, F. (eds.). DEStech Publications Inc., p. 1661-1670 10 p. (Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Machine learning and high-speed circuitry in thin film transistors for sensor interfacing in hybrid large-area electronic systems

Sturm, J. C., Mehlman, Y., Aygun, L. E., Wu, C., Zheng, Z., Kumar, P., Wagner, S. & Verma, N., Jan 1 2019, Semiconductor Process Integration 11. Murota, J., Claeys, C., Iwai, H., Tao, M., Deleonibus, S., Mai, A., Shiojima, K. & Cao, Y. (eds.). 4 ed. Electrochemical Society Inc., p. 121-134 14 p. (ECS Transactions; vol. 92, no. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sensing sheets based on large area electronics for structural health monitoring of bridges

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glišić, B., Jan 1 2019, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019. Lynch, J. P., Huang, H., Sohn, H. & Wang, K-W. (eds.). SPIE, 109702G. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10970).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Static and dynamic strain measurements using sensing sheets for damage detection

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glisic, B., Jan 1 2019, 20th Congress of IABSE, New York City 2019: The Evolving Metropolis - Report. International Association for Bridge and Structural Engineering (IABSE), p. 390-396 7 p. (20th Congress of IABSE, New York City 2019: The Evolving Metropolis - Report).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic Data-driven Hardware Resilience to Efficiently Train Inference Models for Stochastic Hardware Implementations

Zhang, B., Chen, L. Y. & Verma, N., May 2019, 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1388-1392 5 p. 8683521. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations
2018

A Mixed-Signal Binarized Convolutional-Neural-Network Accelerator Integrating Dense Weight Storage and Multiplication for Reduced Data Movement

Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Oct 22 2018, 2018 IEEE Symposium on VLSI Circuits, VLSI Circuits 2018. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-June. p. 141-142 2 p. 8502421

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Scopus citations

A recursive-memory brain-state classifier with 32-channel track-and-zoom Δ2 Σ ADCs and Charge-Balanced Programmable Waveform Neurostimulators

O'Leary, G., Pazhouhandeh, M. R., Chang, M., Groppe, D., Valiante, T. A., Verma, N. & Genov, R., Mar 8 2018, 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018. Institute of Electrical and Electronics Engineers Inc., p. 296-298 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 61).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Artificial intelligence meets large-scale sensing: Using Large-Area Electronics (LAE) to enable intelligent spaces

Ozatay, M., Aygun, L., Jia, H., Kumar, P., Mehlman, Y., Wu, C., Wagner, S., Sturm, J. C. & Verma, N., May 9 2018, 2018 IEEE Custom Integrated Circuits Conference, CICC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-8 8 p. (2018 IEEE Custom Integrated Circuits Conference, CICC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations
2017

A 10-b statistical ADC employing pipelining and sub-ranging in 32nm CMOS

Tao, S., Verma, N., Corey, R. M. & Singer, A. C., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050245. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Compressive information acquisition with hardware impairments and constraints: A case study

Gopalakrishnan, S., Moy, T., Madhow, U. & Verma, N., Jun 16 2017, 2017 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 6075-6079 5 p. 7953323

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High-frequency ZnO schottky diodes for non-contact inductive power transfer in large-area electronics

Aygun, L. E., Wagner, S., Verma, N. & Sturm, J. C., Aug 1 2017, 75th Annual Device Research Conference, DRC 2017. Institute of Electrical and Electronics Engineers Inc., 7999462. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Information-processing-driven interfaces in hybrid large-area electronics systems

Moy, T., Rieutort-Louis, W., Huang, L., Wagner, S., Sturm, J. C. & Verma, N., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050267. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Large-scale acquisition of large-area sensors using an array of frequency-hopping ZnO thin-film-transistor oscillators

Afsar, Y., Moy, T., Brady, N., Wagner, S., Sturm, J. C. & Verma, N., Mar 2 2017, 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Fujino, L. C. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 256-257 2 p. 7870358. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 60).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations
2016

A flexible EEG acquisition and biomarker extraction system based on thin-film electronics

Moy, T., Huang, L., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Feb 23 2016, 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016. Institute of Electrical and Electronics Engineers Inc., p. 294-295 2 p. 7418023. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 59).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

A machine-learning classifier implemented in a standard 6T SRAM array

Zhang, J., Wang, Z. & Verma, N., Sep 21 2016, 2016 IEEE Symposium on VLSI Circuits, VLSI Circuits 2016. Institute of Electrical and Electronics Engineers Inc., 7573556. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

39 Scopus citations

Hybrid large-area systems: Challenges in interfacing

Moy, T., Wagner, S., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C. & Verma, N., Jul 29 2016, ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., p. 1374-1377 4 p. 7527505. (Proceedings - IEEE International Symposium on Circuits and Systems; vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid large-area systems and their interconnection backbone (invited paper)

Verma, N., Aygun, L., Afsar, Y., Hu, Y., Huang, L., Moy, T., Sanz-Robinson, J., Rieutort-Louis, W., Wagner, S. & Sturm, J. C., Sep 28 2016, 2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016. Institute of Electrical and Electronics Engineers Inc., 7579342. (2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robust blind source separation in a reverberant room based on beamforming with a large-aperture microphone array

Sanz-Robinson, J., Huang, L., Moy, T., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., May 18 2016, 2016 IEEE International Conference on Acoustics, Speech and Signal Processing, ICASSP 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 440-444 5 p. 7471713. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations
2015

A large-area image sensing and detection system based on embedded thin-film classifiers

Rieutort-Louis, W., Moy, T., Wang, Z., Wagner, S., Sturm, J. C. & Verma, N., Mar 17 2015, 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. 292-293 2 p. 7063041. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 58).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

A look at signal analysis in resource-constrained medical-sensor applications

Verma, N., Wang, Z. & Zhang, J., Dec 4 2015, IEEE Biomedical Circuits and Systems Conference: Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7348312. (IEEE Biomedical Circuits and Systems Conference: Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

A matrix-multiplying ADC implementing a machine-learning classifier directly with data conversion

Zhang, J., Wang, Z. & Verma, N., Mar 17 2015, 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. 332-333 2 p. 7063061. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 58).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Scopus citations

A seizure-detection IC employing machine learning to overcome data-conversion and analog-processing non-idealities

Zhang, J., Huang, L., Wang, Z. & Verma, N., Nov 25 2015, 2015 IEEE Custom Integrated Circuits Conference, CICC 2015. Institute of Electrical and Electronics Engineers Inc., 7338456. (Proceedings of the Custom Integrated Circuits Conference; vol. 2015-November).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Large-area electronics combined with integrated circuits into a strain sensing sheets

Yao, Y., Tung, S. T., Verma, N., Wagner, S., Sturm, J. & Glisic, B., Jan 1 2015, IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report. International Association for Bridge and Structural Engineering (IABSE), p. 1287-1294 8 p. (IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reconstruction of multiple-user voice commands using a hybrid system based on thin-film electronics and CMOS

Huang, L., Sanz-Robinson, J., Moy, T., Hu, Y., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Aug 25 2015, 2015 Symposium on VLSI Technology, VLSI Technology 2015 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. C196-C197 7223650. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2015-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Reconstruction of multiple-user voice commands using a hybrid system based on thin-film electronics and CMOS

Huang, L., Sanz-Robinson, J., Moy, T., Hu, Y., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Aug 31 2015, 2015 Symposium on VLSI Circuits, VLSI Circuits 2015. Institute of Electrical and Electronics Engineers Inc., p. C196-C197 7231377. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; vol. 2015-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Reducing quantization error in low-energy FIR filter accelerators

Wang, Z., Zhang, J. & Verma, N., Aug 4 2015, 2015 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1032-1036 5 p. 7178126. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2015-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations
2014

12.2 3D gesture-sensing system for interactive displays based on extended-range capacitive sensing

Hu, Y., Huang, L., Rieutort-Louis, W., Sanz-Robinson, J., Wagner, S., Sturm, J. C. & Verma, N., Apr 14 2014, 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers. p. 212-213 2 p. 6757404. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 57).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

29 Scopus citations

3D multi-gesture sensing system for large areas based on pixel self-capacitance readout using TFT scanning and frequency-conversion circuits

Hu, Y., Moy, T., Huang, L., Rieutort-Louis, W., Robinson, J. S., Wagner, S., Sturm, J. C. & Verma, N., Nov 4 2014, Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014. Institute of Electrical and Electronics Engineers Inc., 6946090. (Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, CICC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

A low complexity estimation architecture based on noisy comparators

Corey, R. M., Singer, A. C., Tao, S. & Verma, N., Dec 15 2014, IEEE Workshop on Signal Processing Systems, SiPS: Design and Implementation. Institute of Electrical and Electronics Engineers Inc., 6986081. (IEEE Workshop on Signal Processing Systems, SiPS: Design and Implementation).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An ASIC for readout of post-processed thin-film MEMS resonators by employing capacitive interfacing and active parasitic cancellation

Huang, L., Rieutort-Louis, W., Gualdino, A., Teagno, L., Hu, Y., Mouro, J., Sanz-Robinson, J., Sturm, J. C., Wagner, S., Chu, V., Conde, J. P. & Verma, N., Jan 1 2014, 2014 Symposium on VLSI Circuits, VLSIC 2014 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 6858442. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Current gain of amorphous silicon thin-film transistors above the cutoff frequency

Rieutort-Louis, W., Huang, L., Hu, Y., Sanz-Robinson, J., Moy, T., Afsar, Y., Sturm, J. C., Verma, N. & Wagner, S., Jan 1 2014, 72nd Device Research Conference, DRC 2014 - Conference Digest. Institute of Electrical and Electronics Engineers Inc., p. 273-274 2 p. 6872403. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Enabling hardware relaxations through statistical learning

Wang, Z. & Verma, N., Jan 30 2014, 2014 52nd Annual Allerton Conference on Communication, Control, and Computing, Allerton 2014. Institute of Electrical and Electronics Engineers Inc., p. 319-326 8 p. 7028472. (2014 52nd Annual Allerton Conference on Communication, Control, and Computing, Allerton 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Error-adaptive classifier boosting (EACB): Exploiting data-driven training for highly fault-tolerant hardware

Wang, Z., Schapire, R. & Verma, N., Jan 1 2014, 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014. Institute of Electrical and Electronics Engineers Inc., p. 3884-3888 5 p. 6854329. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

Thin-film circuits for scalable interfacing between large-area electronics and CMOS ICs

Moy, T., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C., Wagner, S. & Verma, N., Jan 1 2014, 72nd Device Research Conference, DRC 2014 - Conference Digest. Institute of Electrical and Electronics Engineers Inc., p. 271-272 2 p. 6872402. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Scopus citations
2013

A fully self-powered hybrid system based on CMOS ICs and large-area electronics for large-scale strain monitoring

Hu, Y., Huang, L., Robinson, J. S., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Sep 17 2013, 2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers. 6578666

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

A low-power microprocessor for data-driven analysis of analytically- intractable physiological signals in advanced medical sensors

Lee, K. H. & Verma, N., Sep 17 2013, 2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers. 6578682. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

A super-regenerative radio on plastic based on thin-film transistors and antennas on large flexible sheets for distributed communication links

Huang, L., Rieutort-Louis, W., Hu, Y., Sanz-Robinson, J., Wagner, S., Sturm, J. C. & Verma, N., Apr 29 2013, 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers. Vol. 56. p. 458-459 2 p. 6487814

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Energy harvesting and power-management for sensing skins in SHM applications

Hu, Y., Huang, L., Rieutort-Louis, W., Sanz-Robinson, J., Wagner, S., Sturm, J. C. & Verma, N., Jan 1 2013, Structural Health Monitoring 2013: A Roadmap to Intelligent Structures - Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM 2013. Chang, F-K. (ed.). DEStech Publications, p. 2771-2778 8 p. (Structural Health Monitoring 2013: A Roadmap to Intelligent Structures - Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM 2013; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hardware specialization of machine-learning kernels: Possibilities for applications and possibilities for the platform design space (invited)

Lee, K. H., Wang, Z. & Verma, N., Jan 1 2013, 2013 IEEE Workshop on Signal Processing Systems, SiPS 2013. Institute of Electrical and Electronics Engineers Inc., p. 330-335 6 p. 6674528. (IEEE Workshop on Signal Processing Systems, SiPS: Design and Implementation).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Towards sensing sheets based on large area electronics

Yao, Y., Tung, S. T. E., Verma, N. & Glisic, B., Jan 1 2013, Structural Health Monitoring 2013: A Roadmap to Intelligent Structures - Proceedings of the 9th International Workshop on Structural Health Monitoring, IWSHM 2013. DEStech Publications, Vol. 2. p. 2787-2794 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations
2012

A 1.2-0.55V general-purpose biomedical processor with configurable machine-learning accelerators for high-order, patient-adaptive monitoring

Lee, K. H. & Verma, N., Dec 14 2012, 2012 Proceedings of the European Solid State Circuits Conference, ESSCIRC 2012. p. 285-288 4 p. 6341275. (European Solid-State Circuits Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

A compressed-domain processor for seizure detection to simultaneously reduce computation and communication energy

Shoaib, M., Jha, N. K. & Verma, N., Nov 26 2012, Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012. 6330601. (Proceedings of the Custom Integrated Circuits Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Scopus citations

A figure of merit for oscillator-based thin-film circuits on plastic for high-performance signaling, energy harvesting and driving of actuation circuits

Rieutort-Louis, W., Huang, L., Hu, Y., Sanz-Robinson, J., Wagner, S., Sturm, J. C. & Verma, N., Oct 5 2012, 70th Device Research Conference, DRC 2012 - Conference Digest. p. 117-118 2 p. 6256980. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Device optimization for integration of thin-film power electronics with thin-film energy-harvesting devices to create power-delivery systems on plastic sheets

Rieutort-Louis, W., Robinson, J. S., Hu, Y., Huang, L., Sturm, J. C., Verma, N. & Wagner, S., Dec 1 2012, 2012 IEEE International Electron Devices Meeting, IEDM 2012. p. 12.3.1-12.3.4 6479029. (Technical Digest - International Electron Devices Meeting, IEDM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Enabling advanced inference on sensor nodes through direct use of compressively-sensed signals

Shoaib, M., Jha, N. K. & Verma, N., May 24 2012, Proceedings - Design, Automation and Test in Europe Conference and Exhibition, DATE 2012. p. 437-442 6 p. 6176511. (Proceedings -Design, Automation and Test in Europe, DATE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations