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Research Output 2005 2019

2019

17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Compressed sensing
Thin film transistors
Hybrid systems
Skin
Electronic equipment

22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications

Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Clocks
Brain
Data storage equipment
Electrodes
Sleep
1 Citation (Scopus)

A 64-Tile 2.4-Mb In-Memory-Computing CNN Accelerator Employing Charge-Domain Compute

Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Jun 1 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1789-1799 11 p., 8660469.

Research output: Contribution to journalArticle

Tile
Neurons
Particle accelerators
Convolution
Data storage equipment

A Large-Area RFID Reader Array Using Large-Area Electronics

Mehlman, J. Y., Kumar, P., Verma, N. & Sturm, J., Mar 25 2019

Research output: Innovation

Radio frequency identification (RFID)
Electronic equipment

An In-memory-Computing DNN Achieving 700 TOPS/W and 6 TOPS/mm in 130-nm CMOS

Zhang, J. & Verma, N., Jun 1 2019, In : IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 9, 2, p. 358-366 9 p., 8695076.

Research output: Contribution to journalArticle

Neural networks
Data storage equipment
Chemical activation
Static random access storage
Parallel processing systems
1 Citation (Scopus)

Exploiting emerging sensing technologies toward structure in data for enhancing perception in human-centric applications

Ozatay, M. & Verma, N., Apr 1 2019, In : IEEE Internet of Things Journal. 6, 2, p. 3411-3422 12 p., 8552441.

Research output: Contribution to journalArticle

Remote sensing
Electronic equipment
Semantics
Sensors
Internet of things
1 Citation (Scopus)

Scaling Up In-Memory-Computing Classifiers via Boosted Feature Subsets in Banked Architectures

Tang, Y., Zhang, J. & Verma, N., Mar 1 2019, In : IEEE Transactions on Circuits and Systems II: Express Briefs. 66, 3, p. 477-481 5 p., 8409339.

Research output: Contribution to journalArticle

Classifiers
Data storage equipment
Signal to noise ratio
Image classification
Particle accelerators
1 Citation (Scopus)

Sensing sheets based on large area electronics for structural health monitoring of bridges

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glisic, B., Jan 1 2019, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019. Lynch, J. P., Sohn, H., Wang, K-W. & Huang, H. (eds.). SPIE, 109702G. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10970).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

structural health monitoring
Structural health monitoring
Fiber optic sensors
Health Monitoring
Integrated circuits
3 Citations (Scopus)

Shannon-Inspired Statistical Computing for the Nanoscale Era

Shanbhag, N. R., Verma, N., Kim, Y., Patil, A. D. & Varshney, L. R., Jan 1 2019, In : Proceedings of the IEEE. 107, 1, p. 90-107 18 p., 8482253.

Research output: Contribution to journalArticle

Memory architecture
Networks (circuits)
Energy efficiency
Signal to noise ratio
Concretes
2018
6 Citations (Scopus)

A Mixed-Signal Binarized Convolutional-Neural-Network Accelerator Integrating Dense Weight Storage and Multiplication for Reduced Data Movement

Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Oct 22 2018, 2018 IEEE Symposium on VLSI Circuits, VLSI Circuits 2018. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-June. p. 141-142 2 p. 8502421

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Particle accelerators
Chemical activation
Neural networks
Static random access storage
Energy efficiency

An Architecture for Large-Area Sensor Acquisition Using Frequency-Hopping ZnO TFT DCOs

Afsar, Y., Moy, T., Brady, N., Wagner, S., Sturm, J. C. & Verma, N., Jan 1 2018, In : IEEE Journal of Solid-State Circuits. 53, 1, p. 297-308 12 p., 8054688.

Research output: Contribution to journalArticle

Frequency hopping
Thin film transistors
Zinc oxide
Oxide films
Sensors
5 Citations (Scopus)

A recursive-memory brain-state classifier with 32-channel track-and-zoom Δ2 Σ ADCs and Charge-Balanced Programmable Waveform Neurostimulators

O'Leary, G., Pazhouhandeh, M. R., Chang, M., Groppe, D., Valiante, T. A., Verma, N. & Genov, R., Mar 8 2018, 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018. Institute of Electrical and Electronics Engineers Inc., p. 296-298 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 61).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Brain
Classifiers
Data storage equipment
Analog circuits
Monitoring
2 Citations (Scopus)

Artificial intelligence meets large-scale sensing: Using Large-Area Electronics (LAE) to enable intelligent spaces

Ozatay, M., Aygun, L., Jia, H., Kumar, P., Mehlman, Y., Wu, C., Wagner, S., Sturm, J. C. & Verma, N., May 9 2018, 2018 IEEE Custom Integrated Circuits Conference, CICC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-8 8 p. (2018 IEEE Custom Integrated Circuits Conference, CICC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Artificial intelligence
Electronic equipment
Systems analysis
Networks (circuits)
Sensors
2 Citations (Scopus)
Error compensation
Data compression
Particle accelerators
Data storage equipment
Discrete cosine transforms
2 Citations (Scopus)
Genetic programming
Particle accelerators
Microprocessor chips
Feature extraction
Hardware
2 Citations (Scopus)

Genetic Programming for Energy-Efficient and Energy-Scalable Approximate Feature Computation in Embedded Inference Systems

Lu, J., Jia, H., Verma, N. & Jha, N. K., Feb 1 2018, In : IEEE Transactions on Computers. 67, 2, p. 222-236 15 p., 8008802.

Research output: Contribution to journalArticle

Genetic programming
Genetic Programming
Energy Efficient
Percent
Feature extraction
3 Citations (Scopus)

NURIP: Neural Interface Processor for Brain-State Classification and Programmable-Waveform Neurostimulation

O'Leary, G., Groppe, D. M., Valiante, T. A., Verma, N. & Genov, R., Jan 1 2018, (Accepted/In press) In : IEEE Journal of Solid-State Circuits.

Research output: Contribution to journalArticle

Brain
Electroencephalography
Band structure
Particle accelerators
Support vector machines
3 Citations (Scopus)

Strain transfer for optimal performance of sensing sheet

Gerber, M., Weaver, C., Aygun, L. E., Verma, N., Sturm, J. C. & Glisic, B., Jun 12 2018, In : Sensors (Switzerland). 18, 6, 1907.

Research output: Contribution to journalArticle

Adhesives
cracks
adhesives
Steel
sensors
2017

A 10-b statistical ADC employing pipelining and sub-ranging in 32nm CMOS

Tao, S., Verma, N., Corey, R. M. & Singer, A. C., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050245. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Error analysis
6 Citations (Scopus)

A Low-Energy Machine-Learning Classifier Based on Clocked Comparators for Direct Inference on Analog Sensors

Wang, Z. & Verma, N., Nov 1 2017, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 64, 11, p. 2954-2965 12 p., 7937849.

Research output: Contribution to journalArticle

Learning systems
Classifiers
Pixels
Sensors
Image recognition
22 Citations (Scopus)

An EEG Acquisition and Biomarker-Extraction System Using Low-Noise-Amplifier and Compressive-Sensing Circuits Based on Flexible, Thin-Film Electronics

Moy, T., Huang, L., Rieutort-Louis, W., Wu, C., Cuff, P., Wagner, S., Sturm, J. C. & Verma, N., Jan 1 2017, In : IEEE Journal of Solid-State Circuits. 52, 1, p. 309-321 13 p.

Research output: Contribution to journalArticle

Low noise amplifiers
Biomarkers
Electroencephalography
Electronic equipment
Thin film transistors

Compressive information acquisition with hardware impairments and constraints: A case study

Gopalakrishnan, S., Moy, T., Madhow, U. & Verma, N., Jun 16 2017, 2017 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 6075-6079 5 p. 7953323

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hardware
Image acquisition
Electronic equipment

Editorial for JETC special issue on alternative computing systems

Topaloglu, R. O. & Verma, N., Mar 1 2017, In : ACM Journal on Emerging Technologies in Computing Systems. 13, 3, 38.

Research output: Contribution to journalEditorial

High-frequency ZnO schottky diodes for non-contact inductive power transfer in large-area electronics

Aygun, L. E., Wagner, S., Verma, N. & Sturm, J. C., Aug 1 2017, 75th Annual Device Research Conference, DRC 2017. Institute of Electrical and Electronics Engineers Inc., 7999462. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid systems
Radio frequency identification (RFID)
Diodes
Electronic equipment
Thin films

Information-processing-driven interfaces in hybrid large-area electronics systems

Moy, T., Rieutort-Louis, W., Huang, L., Wagner, S., Sturm, J. C. & Verma, N., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050267. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid systems
Electronic equipment
Biomarkers
Electroencephalography
Systems analysis
35 Citations (Scopus)

In-Memory Computation of a Machine-Learning Classifier in a Standard 6T SRAM Array

Zhang, J., Wang, Z. & Verma, N., Apr 1 2017, In : IEEE Journal of Solid-State Circuits. 52, 4, p. 915-924 10 p., 7875410.

Research output: Contribution to journalArticle

Static random access storage
Learning systems
Classifiers
Data storage equipment
Networks (circuits)
2 Citations (Scopus)

Large-area electronics: A platform for next-generation human-computer interfaces

Sanz-Robinson, J., Moy, T., Huang, L., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., Mar 1 2017, In : IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 7, 1, p. 38-49 12 p., 7752794.

Research output: Contribution to journalArticle

Interfaces (computer)
Electronic equipment
Signal processing
Source separation
Sensors
7 Citations (Scopus)

Large-scale acquisition of large-area sensors using an array of frequency-hopping ZnO thin-film-transistor oscillators

Afsar, Y., Moy, T., Brady, N., Wagner, S., Sturm, J. C. & Verma, N., Mar 2 2017, 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Fujino, L. C. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 256-257 2 p. 7870358. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 60).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Frequency hopping
Thin film transistors
Electronic equipment
Sensors
Silicon
2016
6 Citations (Scopus)

A flexible EEG acquisition and biomarker extraction system based on thin-film electronics

Moy, T., Huang, L., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Feb 23 2016, 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016. Institute of Electrical and Electronics Engineers Inc., p. 294-295 2 p. 7418023. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 59).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Biomarkers
Electroencephalography
Electronic equipment
Thin films
Thin film transistors
13 Citations (Scopus)

A large-area image sensing and detection system based on embedded thin-film classifiers

Rieutort-Louis, W., Moy, T., Wang, S. Z., Wagner, S. S., Sturm, J. C. & Verma, N., Jan 1 2016, In : IEEE Journal of Solid-State Circuits. 51, 1, p. 281-290 10 p., 7321003.

Research output: Contribution to journalArticle

Classifiers
Thin films
Sensors
Electronic equipment
Thin film transistors
28 Citations (Scopus)

A machine-learning classifier implemented in a standard 6T SRAM array

Zhang, J., Wang, Z. & Verma, N., Sep 21 2016, 2016 IEEE Symposium on VLSI Circuits, VLSI Circuits 2016. Institute of Electrical and Electronics Engineers Inc., 7573556. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Static random access storage
Learning systems
Classifiers
Data storage equipment
Pixels
6 Citations (Scopus)

A Thin-Film, Large-Area Sensing and Compression System for Image Detection

Moy, T., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Nov 1 2016, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 63, 11, p. 1833-1844 12 p.

Research output: Contribution to journalArticle

Compaction
Electronic equipment
Thin film transistors
Thin films
Amorphous silicon
7 Citations (Scopus)

Compressed Signal Processing on Nyquist-Sampled Signals

Lu, J., Verma, N. & Jha, N. K., Nov 1 2016, In : IEEE Transactions on Computers. 65, 11, p. 3293-3303 11 p., 7422045.

Research output: Contribution to journalArticle

Percent
Signal Processing
Signal processing
Random Projection
Spike

Hybrid large-area systems: Challenges in interfacing

Moy, T., Wagner, S., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C. & Verma, N., Jul 29 2016, ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., p. 1374-1377 4 p. 7527505. (Proceedings - IEEE International Symposium on Circuits and Systems; vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid systems
Transducers
Electronic equipment
Silicon
Networks (circuits)

Hybrid large-area systems and their interconnection backbone (invited paper)

Verma, N., Aygun, L., Afsar, Y., Hu, Y., Huang, L., Moy, T., Sanz-Robinson, J., Rieutort-Louis, W., Wagner, S. & Sturm, J. C., Sep 28 2016, 2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016. Institute of Electrical and Electronics Engineers Inc., 7579342. (2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid systems
Electronic equipment
Demonstrations
Silicon
Processing
7 Citations (Scopus)

Impact of bending on flexible metal oxide TFTs and oscillator circuits

Afsar, Y., Tang, J., Rieutort-Louis, W., Huang, L., Hu, Y., Sanz-Robinson, J., Verma, N., Wagner, S. & Sturm, J. C., Jun 1 2016, In : Journal of the Society for Information Display. 24, 6, p. 371-380 10 p.

Research output: Contribution to journalArticle

Oxides
metal oxides
Metals
oscillators
Plastics
7 Citations (Scopus)

Large-Area Microphone Array for Audio Source Separation Based on a Hybrid Architecture Exploiting Thin-Film Electronics and CMOS

Sanz-Robinson, J., Huang, L., Moy, T., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., Apr 1 2016, In : IEEE Journal of Solid-State Circuits. 51, 4, p. 979-991 13 p., 7361744.

Research output: Contribution to journalArticle

Source separation
Microphones
Electronic equipment
Thin films
Thin film transistors
1 Citation (Scopus)

Reducing Quantization Errors for Inner-Product Operations in Embedded Digital Signal Processing Systems [Tips & Tricks]

Wang, Z., Zhang, J. & Verma, N., Nov 1 2016, In : IEEE Signal Processing Magazine. 33, 6, p. 141-147 7 p., 7737100.

Research output: Contribution to journalArticle

Quantization (signal)
Energy resources
Digital signal processing
Convolution
Embedded systems
4 Citations (Scopus)

Robust blind source separation in a reverberant room based on beamforming with a large-aperture microphone array

Sanz-Robinson, J., Huang, L., Moy, T., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., May 18 2016, 2016 IEEE International Conference on Acoustics, Speech and Signal Processing, ICASSP 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 440-444 5 p. 7471713. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Blind source separation
Microphones
Beamforming
Electrets
Electronic equipment
1 Citation (Scopus)

Sensing Sheets Based on Large-Area Electronics and Integrated Circuits

Glisic, B. & Verma, N., Jan 1 2016, Innovative Developments of Advanced Multifunctional Nanocomposites in Civil and Structural Engineering. Elsevier Inc., p. 281-302 22 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Integrated circuits
Networks (circuits)
Sensors
Electronic equipment
Sensor arrays
16 Citations (Scopus)

Strain Sensing Sheets for Structural Health Monitoring Based on Large-Area Electronics and Integrated Circuits

Glisic, B., Yao, Y., Tung, S. T. E., Wagner, S., Sturm, J. C. & Verma, N., Aug 1 2016, In : Proceedings of the IEEE. 104, 8, p. 1513-1528 16 p., 7498639.

Research output: Contribution to journalArticle

Structural health monitoring
Integrated circuits
Networks (circuits)
Sensors
Electronic equipment
2015
4 Citations (Scopus)

A large-area image sensing and detection system based on embedded thin-film classifiers

Rieutort-Louis, W., Moy, T., Wang, Z., Wagner, S., Sturm, J. C. & Verma, N., Mar 17 2015, 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. 292-293 2 p. 7063041. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 58).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Classifiers
Thin films
Thin film transistors
Sensors
Adaptive boosting
1 Citation (Scopus)

A look at signal analysis in resource-constrained medical-sensor applications

Verma, N., Wang, Z. & Zhang, J., Dec 4 2015, IEEE Biomedical Circuits and Systems Conference: Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7348312. (IEEE Biomedical Circuits and Systems Conference: Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

signal analysis
Signal analysis
resources
Medicine
sensors
18 Citations (Scopus)

A matrix-multiplying ADC implementing a machine-learning classifier directly with data conversion

Zhang, J., Wang, Z. & Verma, N., Mar 17 2015, 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. 332-333 2 p. 7063061. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 58).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Learning systems
Classifiers
Feature extraction
Detectors
Signal analysis
4 Citations (Scopus)

A seizure-detection IC employing machine learning to overcome data-conversion and analog-processing non-idealities

Zhang, J., Huang, L., Wang, Z. & Verma, N., Nov 25 2015, 2015 IEEE Custom Integrated Circuits Conference, CICC 2015. Institute of Electrical and Electronics Engineers Inc., 7338456. (Proceedings of the Custom Integrated Circuits Conference; vol. 2015-November).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Learning systems
Processing
Electroencephalography
Learning algorithms
Feature extraction
6 Citations (Scopus)

A System Based on Capacitive Interfacing of CMOS With Post-Processed Thin-Film MEMS Resonators Employing Synchronous Readout for Parasitic Nulling

Huang, L., Rieutort-Louis, W., Gualdino, A., Teagno, L., Hu, Y., Mouro, J., Sanz-Robinson, J., Sturm, J. C., Wagner, S., Chu, V., Conde, J. P. & Verma, N., Apr 1 2015, In : IEEE Journal of Solid-State Circuits. 50, 4, p. 1002-1015 14 p., 7001679.

Research output: Contribution to journalArticle

MEMS
Resonators
Thin films
Electric network analyzers
Passivation
35 Citations (Scopus)

Enabling scalable hybrid systems: Architectures for exploiting large-area electronics in applications

Verma, N., Hu, Y., Huang, L., Rieutort-Louis, W. S. A., Robinson, J. S., Moy, T., Glisic, B., Wagner, S. & Sturm, J. C., Apr 1 2015, In : Proceedings of the IEEE. 103, 4, p. 690-712 23 p., 7110435.

Research output: Contribution to journalArticle

Hybrid systems
Electronic equipment
Networks (circuits)
Structural health monitoring
Transducers
24 Citations (Scopus)

Error Adaptive Classifier Boosting (EACB): Leveraging Data-Driven Training Towards Hardware Resilience for Signal Inference

Wang, Z., Schapire, R. E. & Verma, N., Apr 1 2015, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 62, 4, p. 1136-1145 10 p., 7070874.

Research output: Contribution to journalArticle

Classifiers
Hardware
Adaptive boosting
Learning algorithms
Computer hardware

Frontline technology: Investigating the architecture of flexible large-area hybrid systems

Wagner, S., Sanz-Robinson, J., Rieutort-Louis, W., Huang, L., Moy, T., Hu, Y., Afsar, Y., Sturm, J. C. & Verma, N., Jan 1 2015, In : Information Display. 31, 4

Research output: Contribution to journalShort survey

11 Citations (Scopus)

Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

Rieutort-Louis, W. S. A., Sanz-Robinson, J., Moy, T., Huang, L., Hu, Y., Afsar, Y., Sturm, J. C., Verma, N. & Wagner, S., Sep 1 2015, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 5, 9, p. 1219-1229 11 p., 7163342.

Research output: Contribution to journalArticle

CMOS integrated circuits
Flexible electronics
Thin films
Hybrid systems
Networks (circuits)