If you made any changes in Pure these will be visible here soon.

Research Output

2020

Large-area resistive strain sensing sheet for structural health monitoring

Aygun, L. E., Kumar, V., Weaver, C., Gerber, M., Wagner, S., Verma, N., Glisic, B. & Sturm, J. C., Mar 1 2020, In : Sensors (Switzerland). 20, 5, 1386.

Research output: Contribution to journalArticle

Open Access
3 Scopus citations
2019

17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications

Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-Based Streaming Architectures

Chen, L. Y., Tao, S. & Verma, N., Jun 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1778-1788 11 p., 8630831.

Research output: Contribution to journalArticle

A 64-Tile 2.4-Mb In-Memory-Computing CNN Accelerator Employing Charge-Domain Compute

Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Jun 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1789-1799 11 p., 8660469.

Research output: Contribution to journalArticle

16 Scopus citations

A Large-Area RFID Reader Array Using Large-Area Electronics

Mehlman, J. Y., Kumar, P., Verma, N. & Sturm, J., Mar 25 2019

Research output: Innovation

Analyzing and Increasing Yield of ZnO Thin-Film Transistors for Large-area Sensing Systems by Preventing Process-Induced Gate Dielectric Breakdown

Zheng, Z., Aygun, L. E., Mehlman, Y., Wagner, S., Verma, N. & Sturm, J. C., Jun 2019, 2019 Device Research Conference, DRC 2019. Institute of Electrical and Electronics Engineers Inc., p. 141-142 2 p. 9046406. (Device Research Conference - Conference Digest, DRC; vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An In-memory-Computing DNN Achieving 700 TOPS/W and 6 TOPS/mm in 130-nm CMOS

Zhang, J. & Verma, N., Jun 2019, In : IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 9, 2, p. 358-366 9 p., 8695076.

Research output: Contribution to journalArticle

4 Scopus citations

A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing

Jia, H., Valavi, H., Tang, Y., Zhang, J. & Verma, N., Aug 2019, 2019 IEEE Hot Chips 31 Symposium, HCS 2019. Institute of Electrical and Electronics Engineers Inc., 8875632. (2019 IEEE Hot Chips 31 Symposium, HCS 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Exploiting emerging sensing technologies toward structure in data for enhancing perception in human-centric applications

Ozatay, M. & Verma, N., Apr 1 2019, In : IEEE Internet of Things Journal. 6, 2, p. 3411-3422 12 p., 8552441.

Research output: Contribution to journalArticle

2 Scopus citations

Gigahertz Zinc-Oxide TFT-Based Oscillators

Mehlman, Y., Wu, C., Wagner, S., Verma, N. & Sturm, J. C., Jun 2019, 2019 Device Research Conference, DRC 2019. Institute of Electrical and Electronics Engineers Inc., p. 63-64 2 p. 9046405. (Device Research Conference - Conference Digest, DRC; vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid LAE-CMOS Force-Sensing System Employing TFT-Based Compressed Sensing for Scalability of Tactile Sensing Skins

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Dec 1 2019, In : IEEE transactions on biomedical circuits and systems. 13, 6, p. 1264-1276 13 p.

Research output: Contribution to journalArticle

Large area electronics based sensing sheet for strain monitoring and damage detection of bridges

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glišić, B., Jan 1 2019, Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring. Chang, F-K., Guemes, A. & Kopsaftopoulos, F. (eds.). DEStech Publications Inc., p. 1661-1670 10 p. (Structural Health Monitoring 2019: Enabling Intelligent Life-Cycle Health Management for Industry Internet of Things (IIOT) - Proceedings of the 12th International Workshop on Structural Health Monitoring; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Machine learning and high-speed circuitry in thin film transistors for sensor interfacing in hybrid large-area electronic systems

Sturm, J. C., Mehlman, Y., Aygun, L. E., Wu, C., Zheng, Z., Kumar, P., Wagner, S. & Verma, N., Jan 1 2019, Semiconductor Process Integration 11. Murota, J., Claeys, C., Iwai, H., Tao, M., Deleonibus, S., Mai, A., Shiojima, K. & Cao, Y. (eds.). 4 ed. Electrochemical Society Inc., p. 121-134 14 p. (ECS Transactions; vol. 92, no. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Scaling Up In-Memory-Computing Classifiers via Boosted Feature Subsets in Banked Architectures

Tang, Y., Zhang, J. & Verma, N., Mar 2019, In : IEEE Transactions on Circuits and Systems II: Express Briefs. 66, 3, p. 477-481 5 p., 8409339.

Research output: Contribution to journalArticle

3 Scopus citations

Sensing sheets based on large area electronics for structural health monitoring of bridges

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glišić, B., Jan 1 2019, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019. Lynch, J. P., Huang, H., Sohn, H. & Wang, K-W. (eds.). SPIE, 109702G. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10970).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Shannon-Inspired Statistical Computing for the Nanoscale Era

Shanbhag, N. R., Verma, N., Kim, Y., Patil, A. D. & Varshney, L. R., Jan 2019, In : Proceedings of the IEEE. 107, 1, p. 90-107 18 p., 8482253.

Research output: Contribution to journalArticle

8 Scopus citations

Static and dynamic strain measurements using sensing sheets for damage detection

Kumar, V., Aygun, L. E., Verma, N., Sturm, J. C. & Glisic, B., Jan 1 2019, 20th Congress of IABSE, New York City 2019: The Evolving Metropolis - Report. International Association for Bridge and Structural Engineering (IABSE), p. 390-396 7 p. (20th Congress of IABSE, New York City 2019: The Evolving Metropolis - Report).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic Data-driven Hardware Resilience to Efficiently Train Inference Models for Stochastic Hardware Implementations

Zhang, B., Chen, L. Y. & Verma, N., May 2019, 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1388-1392 5 p. 8683521. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations
2018

A Mixed-Signal Binarized Convolutional-Neural-Network Accelerator Integrating Dense Weight Storage and Multiplication for Reduced Data Movement

Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Oct 22 2018, 2018 IEEE Symposium on VLSI Circuits, VLSI Circuits 2018. Institute of Electrical and Electronics Engineers Inc., p. 141-142 2 p. 8502421. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; vol. 2018-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Scopus citations

An Architecture for Large-Area Sensor Acquisition Using Frequency-Hopping ZnO TFT DCOs

Afsar, Y., Moy, T., Brady, N., Wagner, S., Sturm, J. C. & Verma, N., Jan 2018, In : IEEE Journal of Solid-State Circuits. 53, 1, p. 297-308 12 p., 8054688.

Research output: Contribution to journalArticle

1 Scopus citations

A recursive-memory brain-state classifier with 32-channel track-and-zoom Δ2 Σ ADCs and Charge-Balanced Programmable Waveform Neurostimulators

O'Leary, G., Pazhouhandeh, M. R., Chang, M., Groppe, D., Valiante, T. A., Verma, N. & Genov, R., Mar 8 2018, 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018. Institute of Electrical and Electronics Engineers Inc., p. 296-298 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 61).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Artificial intelligence meets large-scale sensing: Using Large-Area Electronics (LAE) to enable intelligent spaces

Ozatay, M., Aygun, L., Jia, H., Kumar, P., Mehlman, Y., Wu, C., Wagner, S., Sturm, J. C. & Verma, N., May 9 2018, 2018 IEEE Custom Integrated Circuits Conference, CICC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-8 8 p. (2018 IEEE Custom Integrated Circuits Conference, CICC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations
5 Scopus citations
3 Scopus citations

Genetic Programming for Energy-Efficient and Energy-Scalable Approximate Feature Computation in Embedded Inference Systems

Lu, J., Jia, H., Verma, N. & Jha, N. K., Feb 1 2018, In : IEEE Transactions on Computers. 67, 2, p. 222-236 15 p., 8008802.

Research output: Contribution to journalArticle

5 Scopus citations

Large-Area Electronics HF RFID Reader Array for Object-Detecting Smart Surfaces

Mehlman, Y., Kumar, P., Ozatay, M., Wagner, S., Sturm, J. C. & Verma, N., Aug 2018, In : IEEE Solid-State Circuits Letters. 1, 8, p. 182-185 4 p., 8653952.

Research output: Contribution to journalArticle

1 Scopus citations

NURIP: Neural Interface Processor for Brain-State Classification and Programmable-Waveform Neurostimulation

O'Leary, G., Groppe, D. M., Valiante, T. A., Verma, N. & Genov, R., Jan 1 2018, (Accepted/In press) In : IEEE Journal of Solid-State Circuits.

Research output: Contribution to journalArticle

15 Scopus citations

Strain transfer for optimal performance of sensing sheet

Gerber, M., Weaver, C., Aygun, L. E., Verma, N., Sturm, J. C. & Glišić, B., Jun 12 2018, In : Sensors (Switzerland). 18, 6, 1907.

Research output: Contribution to journalArticle

6 Scopus citations
2017

A 10-b statistical ADC employing pipelining and sub-ranging in 32nm CMOS

Tao, S., Verma, N., Corey, R. M. & Singer, A. C., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050245. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A Low-Energy Machine-Learning Classifier Based on Clocked Comparators for Direct Inference on Analog Sensors

Wang, Z. & Verma, N., Nov 1 2017, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 64, 11, p. 2954-2965 12 p., 7937849.

Research output: Contribution to journalArticle

14 Scopus citations

An EEG Acquisition and Biomarker-Extraction System Using Low-Noise-Amplifier and Compressive-Sensing Circuits Based on Flexible, Thin-Film Electronics

Moy, T., Huang, L., Rieutort-Louis, W., Wu, C., Cuff, P., Wagner, S., Sturm, J. C. & Verma, N., Jan 2017, In : IEEE Journal of Solid-State Circuits. 52, 1, p. 309-321 13 p.

Research output: Contribution to journalArticle

30 Scopus citations

Compressive information acquisition with hardware impairments and constraints: A case study

Gopalakrishnan, S., Moy, T., Madhow, U. & Verma, N., Jun 16 2017, 2017 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 6075-6079 5 p. 7953323

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Editorial for JETC special issue on alternative computing systems

Topaloglu, R. O. & Verma, N., Mar 2017, In : ACM Journal on Emerging Technologies in Computing Systems. 13, 3, 38.

Research output: Contribution to journalEditorial

Embedded signal analysis

Wang, Z. & Verma, N., Dec 31 2017, Circuit Design Considerations for Implantable Devices. River Publishers, p. 71-104 34 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

High-frequency ZnO schottky diodes for non-contact inductive power transfer in large-area electronics

Aygun, L. E., Wagner, S., Verma, N. & Sturm, J. C., Aug 1 2017, 75th Annual Device Research Conference, DRC 2017. Institute of Electrical and Electronics Engineers Inc., 7999462. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Information-processing-driven interfaces in hybrid large-area electronics systems

Moy, T., Rieutort-Louis, W., Huang, L., Wagner, S., Sturm, J. C. & Verma, N., Sep 25 2017, IEEE International Symposium on Circuits and Systems: From Dreams to Innovation, ISCAS 2017 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 8050267. (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

In-Memory Computation of a Machine-Learning Classifier in a Standard 6T SRAM Array

Zhang, J., Wang, Z. & Verma, N., Apr 2017, In : IEEE Journal of Solid-State Circuits. 52, 4, p. 915-924 10 p., 7875410.

Research output: Contribution to journalArticle

86 Scopus citations

Large-area electronics: A platform for next-generation human-computer interfaces

Sanz-Robinson, J., Moy, T., Huang, L., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., Mar 2017, In : IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 7, 1, p. 38-49 12 p., 7752794.

Research output: Contribution to journalArticle

3 Scopus citations

Large-scale acquisition of large-area sensors using an array of frequency-hopping ZnO thin-film-transistor oscillators

Afsar, Y., Moy, T., Brady, N., Wagner, S., Sturm, J. C. & Verma, N., Mar 2 2017, 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Fujino, L. C. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 256-257 2 p. 7870358. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 60).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations
2016

A flexible EEG acquisition and biomarker extraction system based on thin-film electronics

Moy, T., Huang, L., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Feb 23 2016, 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016. Institute of Electrical and Electronics Engineers Inc., p. 294-295 2 p. 7418023. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 59).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

A large-area image sensing and detection system based on embedded thin-film classifiers

Rieutort-Louis, W., Moy, T., Wang, S. Z., Wagner, S. S., Sturm, J. C. & Verma, N., Jan 2016, In : IEEE Journal of Solid-State Circuits. 51, 1, p. 281-290 10 p., 7321003.

Research output: Contribution to journalArticle

15 Scopus citations

A machine-learning classifier implemented in a standard 6T SRAM array

Zhang, J., Wang, Z. & Verma, N., Sep 21 2016, 2016 IEEE Symposium on VLSI Circuits, VLSI Circuits 2016. Institute of Electrical and Electronics Engineers Inc., 7573556. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

47 Scopus citations

A Thin-Film, Large-Area Sensing and Compression System for Image Detection

Moy, T., Rieutort-Louis, W., Wagner, S., Sturm, J. C. & Verma, N., Nov 1 2016, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 63, 11, p. 1833-1844 12 p.

Research output: Contribution to journalArticle

7 Scopus citations

Compressed Signal Processing on Nyquist-Sampled Signals

Lu, J., Verma, N. & Jha, N. K., Nov 1 2016, In : IEEE Transactions on Computers. 65, 11, p. 3293-3303 11 p., 7422045.

Research output: Contribution to journalArticle

7 Scopus citations

Hybrid large-area systems: Challenges in interfacing

Moy, T., Wagner, S., Rieutort-Louis, W., Hu, Y., Huang, L., Sanz-Robinson, J., Sturm, J. C. & Verma, N., Jul 29 2016, ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., p. 1374-1377 4 p. 7527505. (Proceedings - IEEE International Symposium on Circuits and Systems; vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hybrid large-area systems and their interconnection backbone (invited paper)

Verma, N., Aygun, L., Afsar, Y., Hu, Y., Huang, L., Moy, T., Sanz-Robinson, J., Rieutort-Louis, W., Wagner, S. & Sturm, J. C., Sep 28 2016, 2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016. Institute of Electrical and Electronics Engineers Inc., 7579342. (2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact of bending on flexible metal oxide TFTs and oscillator circuits

Afsar, Y., Tang, J., Rieutort-Louis, W., Huang, L., Hu, Y., Sanz-Robinson, J., Verma, N., Wagner, S. & Sturm, J. C., Jun 1 2016, In : Journal of the Society for Information Display. 24, 6, p. 371-380 10 p.

Research output: Contribution to journalArticle

7 Scopus citations

Large-Area Microphone Array for Audio Source Separation Based on a Hybrid Architecture Exploiting Thin-Film Electronics and CMOS

Sanz-Robinson, J., Huang, L., Moy, T., Rieutort-Louis, W., Hu, Y., Wagner, S., Sturm, J. C. & Verma, N., Apr 1 2016, In : IEEE Journal of Solid-State Circuits. 51, 4, p. 979-991 13 p., 7361744.

Research output: Contribution to journalArticle

8 Scopus citations