Naveen Verma

Source: Scopus
Calculated based on no. of publications stored in Pure and citations from Scopus

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4 Finished

(YIP) From Sensor Data to High-Value Information: Ultra-Low-Energy Platforms for Deriving Inferences from Complex Embedded Signals
Verma, N.
Air Force Office of Scientific Research
9/30/14 → 9/29/17
Project: Research project
CAREER: Hardware and Algorithmic Architectures for Analyzing Physically-complex Systems: Embedding Inference Capabilities in Ultra-low-power sensors
Verma, N.
NSF - National Science Foundation
3/1/13 → 2/28/19
Project: Research project
Combining Large-area Electronics with High-performance Computation for Scalable Ambient Intelligence
Verma, N.
NSF - National Science Foundation
7/1/12 → 6/30/16
Project: Research project
SHF: Small: Analytical Modeling and Design Methodology for Large-scale Computational Systems Employing Flexible Electronics for Extensive Physical Interfacing
Verma, N.
NSF - National Science Foundation
7/1/12 → 6/30/16
Project: Research project

4440 Citations
28 h-Index
68 Conference contribution
56 Article
3 Editorial
3 Innovation
More

Large-area resistive strain sensing sheet for structural health monitoring
Aygun, L. E., Kumar, V., Weaver, C., Gerber, M., Wagner, S., Verma, N., Glisic, B. & Sturm, J. C., Mar 1 2020, In: Sensors (Switzerland). 20, 5, 1386.
Research output: Contribution to journal › Article › peer-review

Open Access
5 Scopus citations
Reducing Energy of Approximate Feature Extraction in Heterogeneous Architectures for Sensor Inference via Energy-Aware Genetic Programming
Tang, Y., Jia, H. & Verma, N., May 2020, In: IEEE Transactions on Circuits and Systems I: Regular Papers. 67, 5, p. 1576-1587 12 p., 8952908.
Research output: Contribution to journal › Article › peer-review
17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing
Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications
Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5 Scopus citations
A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-Based Streaming Architectures
Chen, L. Y., Tao, S. & Verma, N., Jun 2019, In: IEEE Journal of Solid-State Circuits. 54, 6, p. 1778-1788 11 p., 8630831.
Research output: Contribution to journal › Article › peer-review