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Naveen Verma

  • 4267 Citations
  • 27 h-Index
20052020

Research output per year

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Projects

(YIP) From Sensor Data to High-Value Information: Ultra-Low-Energy Platforms for Deriving Inferences from Complex Embedded Signals

Verma, N.

Air Force Office of Scientific Research

9/30/14 → 9/29/17

Project: Research project

    • CAREER: Hardware and Algorithmic Architectures for Analyzing Physically-complex Systems: Embedding Inference Capabilities in Ultra-low-power sensors

    Verma, N.

    NSF - National Science Foundation

    3/1/13 → 2/28/19

    Project: Research project

    • Combining Large-area Electronics with High-performance Computation for Scalable Ambient Intelligence

    Verma, N.

    NSF - National Science Foundation

    7/1/12 → 6/30/16

    Project: Research project

    • SHF: Small: Analytical Modeling and Design Methodology for Large-scale Computational Systems Employing Flexible Electronics for Extensive Physical Interfacing

    Verma, N.

    NSF - National Science Foundation

    7/1/12 → 6/30/16

    Project: Research project

    • Research Output

    Large-area resistive strain sensing sheet for structural health monitoring

    Aygun, L. E., Kumar, V., Weaver, C., Gerber, M., Wagner, S., Verma, N., Glisic, B. & Sturm, J. C., Mar 1 2020, In : Sensors (Switzerland). 20, 5, 1386.

    Research output: Contribution to journal › Article

    Open Access
    • 3 Scopus citations

    Reducing Energy of Approximate Feature Extraction in Heterogeneous Architectures for Sensor Inference via Energy-Aware Genetic Programming

    Tang, Y., Jia, H. & Verma, N., May 2020, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 67, 5, p. 1576-1587 12 p., 8952908.

    Research output: Contribution to journal › Article

    • 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

    Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • 22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications

    Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    • 5 Scopus citations

    A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-Based Streaming Architectures

    Chen, L. Y., Tao, S. & Verma, N., Jun 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1778-1788 11 p., 8630831.

    Research output: Contribution to journal › Article