Calculated based on number of publications stored in Pure and citations from Scopus
1992 …2022

Research activity per year

If you made any changes in Pure these will be visible here soon.

Network

Nariman Farsad

  • Stanford University
  • Ryerson University
  • Friedrich-Alexander University Erlangen-Nürnberg
  • Stanford

External person

Yonina C. Eldar

  • Technion-Israel Institute of Technology
  • Stanford University
  • Technion
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • Weizmann Institute of Science
  • Ben-Gurion University of the Negev
  • Technion
  • Ryerson University
  • The Chinese University of Hong Kong, Shenzhen

External person

Mainak Chowdhury

  • Stanford University
  • ZaiNar Inc.
  • Cohere Technologies
  • ZaiNar Inc.

External person

Shuguang Cui

  • Texas A&M University
  • King Abdulaziz University
  • Stanford University
  • University of California Office of the President
  • University of California at Davis
  • University of Arizona
  • Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Dept. of Electr. and Comput. Eng.
  • Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of California
  • University of California at Berkeley
  • University of California
  • IEEE
  • National Semiconductor Corporation

External person

Ivana Marić

  • Stanford University
  • Southeast University, Nanjing
  • Networks, Santa Clara
  • Aviat Networks
  • Rutgers - The State University of New Jersey, New Brunswick
  • Ericsson AB

External person

Deniz Gündüz

  • Catalan Telecommunications Technology Centre
  • Princeton University
  • Stanford University
  • Imperial College London
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Centre Tecnològic de Telecomunicacions de Catalunya
  • Dept. of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering
  • New York University

External person

Syed Ali Jafar

  • University of California at Irvine
  • Department of Electrical Engineering and Computer Science
  • CPCC
  • Stanford University

External person

Stefano Rini

  • Stanford University
  • National Yang Ming Chiao Tung University
  • Technical University of Munich
  • National Yangming Jiaotong University (NPJU)
  • NCTU Taiwan

External person

Mohamed Slim Alouini

  • King Abdullah University of Science and Technology
  • California Institute of Technology
  • University of Minnesota Twin Cities
  • Texas A&M University at Qatar
  • ComUE Paris-Saclay
  • National Science Foundation
  • Sorbonne Université
  • Fr. Natl. Ctr. of Telecommunications
  • Georgia Institute of Technology
  • University of California at Berkeley
  • Stanford University

External person

Alon Kipnis

  • Stanford University

External person

Nihar Jindal

  • Stanford University
  • University of Minnesota Twin Cities
  • IEEE

External person

Sriram Vishwanath

  • University of Texas at Austin
  • Department of Electrical and Computer Engineering
  • Stanford University

External person

Alexandros Manolakos

  • Stanford University
  • Qualcomm Incorporated

External person

Ron Dabora

  • Ben-Gurion University of the Negev
  • Stanford University

External person

Yonathan Murin

  • Stanford University

External person

Milind Rao

  • Stanford University
  • Amazon.com, Inc.

External person

Muriel Médard

  • MIT
  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Institute of Technology
  • MIT
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • MIT

External person

Sachin Adlakha

  • Stanford University
  • California Institute of Technology

External person

Yue Zhao

  • Stony Brook University
  • Stanford University
  • Princeton University
  • Dept. of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering

External person

Shlomo Shamai

  • Technion-Israel Institute of Technology
  • Princeton University
  • IEEE
  • University of Illinois at Chicago
  • Lucent
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering Technion
  • Dept. of EE
  • TechnionVIsrael Institute of Technology
  • Technion
  • Department of Electrical Engineering
  • Technion
  • Technion
  • Technion

External person

Chris T.K. Ng

  • Stanford University
  • Lucent
  • Massachusetts Institute of Technology

External person

Michelle Effros

  • IEEE
  • California Institute of Technology
  • Department of Electrical Engineering (MC 136-93)
  • Department of Electrical Engineering
  • Stanford University

External person

Taesang Yoo

  • Stanford University
  • Qualcomm Incorporated
  • IEEE

External person

Tim Holliday

  • Princeton University
  • Goldman Sachs and Co.
  • Goldman Sachs Group
  • Stanford University
  • Lucent

External person

Sanjay Lall

  • Stanford University
  • IEEE

External person

Yifan Liang

  • Stanford University
  • Goldman Sachs Group

External person

John M. Cioffi

  • Stanford University
  • Department of Electrical Engineering

External person

Seyyed Ali Hashemi

  • Stanford University
  • Qualcomm Incorporated

External person

Juan M. Romero-Jerez

  • University of Málaga
  • IEEE

External person

Yair Noam

  • Ben-Gurion University of the Negev
  • Department of Electrical Engineering
  • Stanford University
  • Bar-Ilan University

External person

F. Javier Lopez-Martinez

  • University of Málaga
  • Stanford University

External person

Thomas R. Dean

  • Stanford University

External person

José F. Paris

  • University of Málaga

External person

Elza Erkip

  • Princeton University
  • New York University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • NYU
  • Department of Electrical Engineering

External person

Ernest Kurniawan

  • Stanford University
  • Agency for Science, Technology and Research

External person

Daniel O'Neill

  • Sun Microsystems
  • Stanford University
  • Department of Electrical Engineering

External person

Tara Javidi

  • University of California at San Diego

External person

S. Toumpis

  • Telecom. Res. Center
  • Stanford University
  • University of Cyprus
  • IEEE

External person

X. Liu

  • Stanford University

External person

Zhi Quan Luo

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Minnesota

External person

Jin Jun Xiao

  • University of Minnesota Twin Cities
  • Washington University St. Louis
  • Department of Electrical and Systems Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Minnesota

External person

Stephen Boyd

  • Stanford University
  • Dept. of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering
  • IMT School for Advanced Studies Lucca

External person

Tsachy Weissman

  • Stanford University
  • Technion-Israel Institute of Technology
  • Hewlett-Packard
  • Dept. of Electrical Engineering
  • Electrical Engineering
  • Department of Statistics
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • Department of Electrical Engineering

External person

Peter Glynn

  • Stanford University

External person

Eduardo Martos-Naya

  • University of Málaga

External person

Michal Yemini

  • Stanford University
  • Princeton University

External person

Reza Mirghaderi

  • Stanford University
  • Alphabet Inc.

External person

Boon Sim Thian

  • Stanford University
  • Agency for Science, Technology and Research

External person

Gerard Foschini

  • Lucent
  • University of California at Berkeley

External person

Nan Liu

  • Stanford University
  • Southeast University, Nanjing
  • School of Information Science and Engineering
  • Department of Electrical Engineering

External person

Mahnoosh Alizadeh

  • University of California at Santa Barbara
  • Stanford University
  • Office of Electricity Delivery and Energy Reliability of the US

External person

Ritesh Madan

  • Stanford University
  • Qualcomm Incorporated
  • IEEE

External person

Sina Firouzabadi

  • Stanford University

External person

Anna Scaglione

  • University of California at Davis
  • Dept. of Electr. and Comput. Eng.
  • Arizona State University
  • Office of Electricity Delivery and Energy Reliability of the US

External person

Chan Byoung Chae

  • Yonsei University

External person

Nir Shlezinger

  • Weizmann Institute of Science
  • Ben-Gurion University of the Negev
  • Ryerson University
  • The Chinese University of Hong Kong, Shenzhen

External person

Ramesh Johari

  • Stanford University
  • Department of Management Science and Engineering

External person

N. B. Mehta

  • California Institute of Technology
  • Stanford University
  • IEEE
  • AT&T

External person

Ahmad Bahai

  • Stanford University
  • IEEE
  • National Semiconductor Corporation

External person

Larry J. Greenstein

  • Rutgers - The State University of New Jersey, New Brunswick
  • AT&T
  • IEEE
  • Wireless Information Network Laboratory (WINLAB)
  • Lucent
  • California Institute of Technology
  • University of California at Berkeley
  • Rutgers University

External person

Gabriel Weintraub

  • Columbia University

External person

Marco Levorato

  • Bren School of Information and Computer Sciences
  • University of California at Irvine
  • Stanford University
  • University of Southern California

External person

Pulkit Grover

  • Stanford University
  • Carnegie Mellon University

External person

Pravin Varaiya

  • University of California at Berkeley
  • IEEE

External person

Yao Xie

  • Stanford University
  • Duke University

External person

Marco Mondelli

  • Institute of Science and Technology Austria

External person

Ezio Biglieri

  • Pompeu Fabra University
  • University of California at Los Angeles
  • King Saud University

External person

Xiaoyi Tang

  • California Institute of Technology
  • University of California at Berkeley
  • University of Minnesota Twin Cities

External person

Lifang Li

  • Exeter Group Inc.
  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

Osvaldo Simeone

  • New Jersey Institute of Technology
  • Technion-Israel Institute of Technology
  • Center for Wireless Communications and Signal Processing Researsh
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Center of Wireless Communication

External person

H. Birkan Yilmaz

  • Bogazici University
  • Yonsei University
  • Polytechnic University of Catalonia

External person

Hoi To Wai

  • Arizona State University
  • University of California at Davis

External person

Jianshu Chen

  • Microsoft USA
  • University of California at Los Angeles
  • Electrical Engineering Department
  • Tencent AI Lab.
  • Tencent

External person

Jinhua Jiang

  • Stanford University
  • Qualcomm Incorporated
  • Electrical Engineering

External person

Vahid Jamali

  • Institute for Digital Communications at Friedrich-Alexander University Erlangen-Nürnberg (FAU). (e-mail:
  • Institute for Digital Communications at Friedrich-Alexander University Erlangen-Nürnberg (FAU
  • Friedrich-Alexander University Erlangen-Nürnberg
  • Princeton University

External person

Mary Wootters

  • Stanford University

External person

B. Sinopoli

  • Carnegie Mellon University
  • Stanford University

External person

Urbashi Mitra

  • University of Southern California
  • Ohio State University
  • Princeton University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • The Department of Electrical Engineering

External person

Robert Schober

  • Friedrich-Alexander University Erlangen-Nürnberg
  • Friedrich- Alexander-University Erlangen-Nurnberg (FAU)
  • Institute for Digital Communications
  • Institute for Digital Communications
  • Friedrich-Alexander-University Erlangen-Nurnberg (FAU)
  • Friedrich-Alexander-University Erlangen-Nurnberg (FAU)
  • Institute for Digital Communications
  • Institute for Digital Communications at Friedrich-Alexander University Erlangen-Nürnberg (FAU
  • Princeton University

External person

Gerhard Kramer

  • Technical University of Munich
  • University of Southern California
  • Lucent
  • New Jersey Institute of Technology
  • Syracuse University
  • Princeton University
  • Department of Electrical Engineering
  • Department of EECS
  • Department of Electrical Engineering and Information Technology
  • EE Department
  • Department of EE

External person

Felipe Gomez-Cuba

  • University of Padua
  • University of Vigo

External person

Unai Fernández-Plazaola

  • University of Málaga

External person

Andrew Eckford

  • York University Toronto

External person

Yun Liao

  • Stanford University

External person

Juan P.Pẽ Na-Martin

  • University of Málaga

External person

Ram Rajagopal

  • Stanford University
  • Department of Civil and Environmental Engineering

External person

Sheng Yang

  • CentraleSupélec
  • ComUE Paris-Saclay

External person

L. Li

  • California Institute of Technology

External person

Nick Bambos

  • Stanford University

External person

Lin Xiao

  • Stanford University

External person

F. K. Jondral

  • Karlsruhe Institute of Technology

External person

Haitham Hindi

  • Stanford University
  • Palo Alto Research Center

External person

Xiaoqing Zhu

  • Stanford University

External person

Karthik Ganesan

  • University of California at Berkeley
  • Stanford University

External person

Soon Ghee Chua

  • Singapore Technologies Telecommunications Pte Ltd.
  • California Institute of Technology
  • Stanford University

External person

Mikael Johansson

  • KTH Royal Institute of Technology
  • Stanford University

External person

H. Jäkel

  • Karlsruhe Institute of Technology

External person

T. Renk

  • Karlsruhe Institute of Technology

External person

Ayfer Özgür

  • Stanford University

External person

Nima Soltani

  • Stanford University

External person

Bernd Girod

  • Stanford University

External person

Sang Wu Kim

  • California Institute of Technology
  • Korea Advanced Institute of Science and Technology

External person

Fabrizio Granelli

  • University of Trento

External person

J. Rabaey

  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • EECS Department
  • Berkeley Wireless Research Center
  • Department of Electrical Engineering and Computer Sciences

External person

Lili Zhang

  • Texas A&M University
  • Qualcomm Incorporated

External person

A. Robert Calderbank

  • Princeton University
  • IEEE
  • Duke University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering and Mathematics Departments
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Dept. Elec. Eng. Princeton Mat. I.
  • EIectrical Engineering and Mathematics Departments
  • Cohere Technologies, Inc.

External person

Ruiyang Song

  • Tsinghua University
  • Stanford University

External person

Sheng Zhou

  • Tsinghua University

External person

Daniel P. Palomar

  • Princeton University
  • Hong Kong University of Science and Technology
  • IEEE
  • Department of Electrical Engineering
  • Department of Electronic and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Yuejie Chi

  • Ohio State University
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • Carnegie Mellon University
  • CMU
  • CMU
  • Princeton University

External person

S. T. Chung

  • Stanford University
  • IEEE

External person

Jinyuan Chen

  • Stanford University

External person

Rajarshi Saha

  • Stanford University

External person

Anteneh A. Gebremariam

  • University of Trento

External person

Wonjong Rhee

  • ASSIA, Inc.
  • ArrayComm Inc.

External person

Hamid Aghajan

  • Stanford University

External person

Gabriel Aguilera

  • University of Málaga

External person

Stephanie Gil

  • Harvard University

External person

Eric Setton

  • Stanford University

External person

J. Karl Hedrick

  • University of California at Berkeley
  • Stanford University

External person

Aylin Yener

  • Pennsylvania State University
  • Stanford University
  • Department of Electrical Engineering
  • Electrical Engineering

External person

Changho Suh

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering
  • School of Electrical Engineering

External person

S. Rakib

  • Cohere Technologies, Inc.

External person

Natasha Devroye

  • University of Illinois at Chicago
  • Department of Electrical and Computer Engineering

External person

Joshua W. Shao

  • California Institute of Technology

External person

A. F. Molisch

  • Mitsubishi Electric Research USA
  • Lund University
  • IEEE
  • AT&T
  • Wireless Systems Research Division
  • Department of Electrical and Information Technology
  • Department of Electroscience
  • University of Southern California
  • Cohere Technologies, Inc.
  • Mitsubishi Electric Corporation

External person

Sean Meyn

  • UTUC
  • University of Illinois at Urbana-Champaign

External person

Ralf Koetter

  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • Technical University of Munich

External person

Jeremy Kim

  • Stanford University

External person

A. Casavola

  • University of Calabria

External person

Ronny Hadani

  • University of Texas at Austin
  • Department of Mathematics
  • Cohere Technologies, Inc.

External person

Jianyi Huang

  • University of Illinois at Urbana-Champaign

External person

Zizheng Cao

  • Eindhoven University of Technology

External person

Md J. Hossain

  • University of Victoria BC
  • University of British Columbia

External person

Hikmet Sari

  • Sequans Communications
  • Supélec

External person

V. K. Bhargava

  • University of Victoria BC
  • University of British Columbia

External person

Raffi Avo Sevlian

  • Stanford University
  • Electrical Engineering

External person

P. K. Vitthaladevuni

  • University of Minnesota Twin Cities
  • Qualcomm Incorporated

External person

Jonathan Perlstein

  • Stanford University

External person

Antonio Pascual-Iserte

  • Polytechnic University of Catalonia

External person

Haotian Zheng

  • Eindhoven University of Technology

External person

Javier Rubio

  • Polytechnic University of Catalonia

External person

Stuart C. Schwartz

  • Princeton University
  • IEEE
  • Technion-Israel Institute of Technology
  • University of California at Berkeley
  • Swiss Federal Institute of Technology Zurich
  • Image Sciences Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Arman Fazeli

  • University of California at San Diego
  • Apple

External person

M. Tsatsanis

  • Cohere Technologies, Inc.

External person

Zhisheng Niu

  • Tsinghua University

External person

Haim Permuter

  • Stanford University
  • Ben-Gurion University of the Negev
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Electrical Engineering
  • Department of Electrical Engineering

External person

Daniela Tuninetti

  • Swiss Federal Institute of Technology Lausanne
  • EURECOM
  • Swiss Federal Institute of Technology
  • Institut Eurékom
  • University of Illinois at Chicago
  • Sch. of Comp. and Info. Sciences
  • Department of Electrical and Computer Engineering
  • Mobile Communication Laboratory
  • Swiss Federal Institute of Technology Zurich

External person

Farhad Meshkati

  • Princeton University
  • IEEE
  • Qualcomm Incorporated
  • Corporate RandD Systems
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

David Gesbert

  • EURECOM
  • IEEE
  • University of Oslo

External person

Daniel Zahavi

  • Ben-Gurion University of the Negev

External person

Nicole Grimwood

  • Stanford University

External person

Anant Sahai

  • University of California at Berkeley

External person

E. Garone

  • University of Calabria
  • Université libre de Bruxelles

External person

Levan Ghaghanidze

  • Technical University of Munich

External person

Chao Tian

  • AT&T
  • Texas A&M University
  • Swiss Federal Institute of Technology Lausanne

External person

Weisi Guo

  • University of Warwick

External person

A. Monk

  • Cohere Technologies, Inc.

External person

Alexander Vardy

  • University of California at San Diego

External person

Christopher Rose

  • Brown University

External person

Neta S. Zuckerman

  • City of Hope National Med Center
  • Genentech Incorporated
  • Stanford University

External person

Marvin K. Simon

  • California Institute of Technology
  • Jet Propulsion Laboratory, California Institute of Technology

External person

Xiangheng Liu

  • Stanford University

External person

Stephen B. Wicker

  • Cornell University
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • IEEE

External person

Bertrand Muquet

  • Sequans Communications

External person

Junjie Qin

  • Stanford University
  • Institute for Computational and Mathematical Engineering

External person

Hesham Elbakoury

  • Huawei Technologies Co., Ltd.

External person

Joachim Sachs

  • Stanford University
  • Ericsson AB

External person

Ton Koonen

  • Eindhoven University of Technology

External person

Miguel Angel Lagunas

  • European Union
  • Academy of Engineers of
  • Academy of Science and Art of Barcelona
  • Catalan Telecommunications Technology Centre

External person

Anthony Constantinides

  • Department of Chemistry
  • Imperial College London

External person

Angelia Nedich

  • Arizona State University
  • Department of Electrical, Computer, and Energy Engineering

External person

Mariam Kaynia

  • Norwegian University of Science and Technology

External person

Mohammad A. Khojastepour

  • NEC Laboratories America, Inc.
  • NEC Corporation

External person

O. Oteri

  • Stanford University

External person

Arogyaswami Paulraj

  • Stanford University

External person

Kevin C. Yu

  • Stanford University

External person

Abbas Kazerouni

  • Stanford University

External person

Ho Park Hyung

  • LG Corporation

External person

Junyoung Nam

  • Qualcomm Incorporated
  • Electronics and Telecommunications Research Institute

External person

Se Yong Park

  • University of California at San Diego

External person

Galen Reeves

  • Duke University

External person

Olivier Gevaert

  • Stanford University

External person

F. Javier Lopez-Martinez

  • University of Málaga

External person

Oh Minseok

  • LG Corporation

External person

Dalin Zhu

  • NEC Corporation

External person

Huang Lee

  • Stanford University

External person

Kartik Venkat

  • Stanford University

External person

Kevin Schubert

  • Stanford University

External person

Emily E. Wesel

  • Stanford University

External person

Brian Knott

  • Stanford University

External person

Ertem Tuncel

  • University of California at Riverside
  • Electrical Engineering

External person

Ming Lei

  • NEC Corporation

External person

Idoia Ochoa

  • Stanford University

External person

Ilker Demirkol

  • Polytechnic University of Catalonia

External person

Suhas Diggavi

  • Swiss Federal Institute of Technology Lausanne
  • University of California at Los Angeles
  • Swiss Federal Institute of Technology
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • EE Dept.
  • Swiss Federal Institute of Technology Zurich
  • School of Computer and Communication Sciences

External person

Geir E. Øien

  • Norwegian University of Science and Technology

External person

Nghia Doan

  • McGill University

External person

Mahdi Ben Ghorbel

  • King Abdullah University of Science and Technology

External person

Muhammad Usman

  • University of Trento

External person

Behnaam Aazhang

  • Rice University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Stanford University
  • Univ of Illinois, Urbana, IL, USA

External person

Jeffrey Mounzer

  • Stanford University

External person

Samuel Dolinar

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Manoneet Singh

  • Radia Communications
  • Stanford University
  • IEEE

External person

Georgios B. Giannakis

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering

External person

J. Nicholas Laneman

  • University of Notre Dame

External person

Rajiv Nambiar

  • California Institute of Technology

External person

C. Ibars

  • Cohere Technologies, Inc.

External person

Maryam Olyaee

  • University of Málaga

External person

H. Vincen Tpoor

  • Princeton University

External person

Georgia Murray

  • Stanford University

External person

Dina Katabi

  • Massachusetts Institute of Technology
  • MIT

External person

Sergio Barbarossa

  • University of Rome La Sapienza
  • Department of Information

External person

Ekine Akuiyibo

  • Stanford University

External person

Lieven Vandenberghe

  • University of California at Los Angeles

External person

Ananth Grama

  • Purdue University

External person

Ranjan K. Mallik

  • Indian Institute of Technology Delhi

External person

Christos Komninakis

  • Qualcomm Incorporated

External person

Yue Yue Fan

  • University of California at Davis

External person

Eunchul Yoon

  • Stanford University

External person

Todd P. Coleman

  • Massachusetts Institute of Technology

External person

Anna Scaglione

  • Arizona State University

External person

Laura Savidge

  • Stanford University

External person

Shahin Mohammadi

  • Purdue University

External person

Elza Erkipt

  • New York University

External person

Vijay Gupta

  • California Institute of Technology

External person

Mehmet Sukru Kuran

  • Bahcesehir University

External person

Peter P. Lee

  • City of Hope National Med Center

External person

Sudhir Srinivasa

  • University of California at Irvine

External person

Angel Lozano

  • Nokia
  • Lucent
  • Columbia University

External person

George Kesidis

  • Office of Electricity Delivery and Energy Reliability of the US

External person

Richard M. Murray

  • California Institute of Technology
  • Mechanical Engineering
  • Division of Engineering and Applied Science
  • Division of Engineering and Applied Science
  • Division of Engineering and Applied Science
  • Department of Mechanical Engineering
  • Division of Engineering and Applied Science

External person

Russ Islam

  • Stanford University

External person

T. Davidson

  • McMaster University

External person

Bojan Boštjančič

  • Aviat Networks

External person

Moe Z. Win

  • Massachusetts Institute of Technology
  • Laboratory for Information and Decision Systems

External person

Narayan Mandayam

  • Rutgers - The State University of New Jersey, New Brunswick
  • Indian Institute of Technology Kharagpur
  • Rice University
  • ECE Department at Rutgers
  • Wireless Information Network Laboratory (WINLAB)
  • WINLAB
  • WINLAB
  • Department of Electrical Engineering
  • Rutgers University
  • ECE department at Rutgers
  • ECE department at Rutgers
  • WINLAB
  • Rutgers University
  • Rutgers University
  • Rutgers University
  • Rutgers University

External person

Yong Ping Zhang

  • Huawei Technologies Co., Ltd.

External person

Rajiv Agarwal

  • Stanford University

External person

Josef Parvizi

  • Stanford University
  • Dept. of Neurol. and Neurol. Sci.

External person

Deniz Gundiiz

  • Stanford University
  • Princeton University
  • Department of Electrical Engineering
  • Electrical Engineering

External person

S. S. Mahal

  • Stanford University

External person

Emre Ozfatura

  • Imperial College London

External person

Jong Woo Kwack

  • Yonsei University

External person

Hai Xin Tie

  • California Institute of Technology

External person

Sumanth Jagannathan

  • Stanford University

External person

Theo Diamandis

  • Stanford University

External person

Roy D. Yates

  • Stanford University

External person

W. J. Gross

  • McGill University
  • ECE Department

External person

Alexios Balatsoukas-Stimming

  • Eindhoven University of Technology

External person

W. Yu

  • Stanford University

External person

David Pan

  • Stanford University

External person

Jong Woo Kwak

  • Yonsei University

External person

Peng Wang

  • University of Sydney

External person

Rohit Negi

  • Stanford University

External person

Yang Wen

  • University of California at Berkeley

External person

Richard D. Wesel

  • University of California at Los Angeles

External person

J. Sayir

  • Telecom. Res. Center

External person

Yirong Shen

  • Stanford University

External person

Larry B. Milstein

  • University of California at San Diego

External person

J. Delfeld

  • Cohere Technologies, Inc.

External person

Will Chuang

  • University of California at Los Angeles

External person

A. M.J. Koonen

  • Eindhoven University of Technology

External person

Dariush Divsalar

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Changmin Lee

  • Yonsei University

External person

Lizhong Zheng

  • Massachusetts Institute of Technology
  • MIT
  • Department of Electrical Engineering and Computer Science
  • Laboratory for Information and Decision Systems
  • Department of Electrical Engineering and Computer Science
  • Research Laboratory of Electronics
  • MIT

External person

Sachin Katti

  • Open Network Foundation
  • MIT
  • Stanford University

External person

Ho Moon Sung

  • LG Corporation

External person